E-Beam Wafer Inspection System Market By Type (Less Than 1 Nm, 1 Nm To 10 Nm, More Than 10 Nm) - Growth, Future Prospects And Competitive Analysis 2017 – 2025

With the rapid and continuous advancement in the electronics and semiconductor industries, defect management has become more critical than ever before. The overall industry tends towards further miniaturization of electronic devices, leading to more complex designs and manufacturing processes.

As a result, accurate semiconductor inspection becomes a serious concern for manufacturers. However, with the decreasing size of electronic components and integrated circuits, popular inspection techniques such as optical inspection systems prove to be ineffective, especially in extremely small dimensions. Subsequently, the e-beam wafer inspection method has been witnessing profound attention from the electronic and semiconductor industries for the past few years.

E-beam wafer inspection systems are semiconductor fabrication tools based on electron beam scanning. These systems are typically used in research and development, where accuracy remains the utmost priority. The e-beam wafer inspection method is capable of working in the range of 2 nm, making it highly suitable for inspecting semiconductor wafers. The main disadvantage of this tool is its slow throughput, which leads to a long manufacturing time.

As a result, the technology is yet to become popular in production facilities, requiring faster throughput times. Nevertheless, due to increasing efforts towards maximizing the throughput time (e.g., by engaging multiple beams), the market for e-beam wafer inspection systems holds immense potential for future growth.

The report titled "Global E-beam Wafer Inspection System Market: Growth, Future Prospects, and Competitive Analysis, 2017–2025" offers strategic insights into the global e-beam wafer inspection system market, along with the market size and estimates for the duration of 2015–2025. The said research study covers an in-depth analysis of market segments based on product type and a cross-sectional study across different geographies and sub-geographical regions.

The study covers the comparative analysis of different segments for the years 2016 and 2025. The report also provides a prolific view of market dynamics, such as market drivers, restraints, and opportunities. In addition, the report includes a section providing insights into the key trends followed in the market.

The report also includes competitive profiling of the leading e-beam wafer inspection system vendors, their business strategy analysis, market positioning, and key developments to assist strategic decision-makers.Some of the major players profiled in the report are ASML Holding NV, Applied Materials, Inc., KLA-Tencor Corporation, Lam Research Corporation, NXP Semiconductors NV, Taiwan Semiconductor Manufacturing Co., Ltd., Renesas Electronics Corporation, and others.

Apart from the company profiles, the report includes a section covering the competitive landscape, wherein the market positioning of the companies is discussed. The section also provides an overview of the key business strategies employed by the leading market participants. Other in-depth analysis provided in the report includes:

  • Current and future market trends to justify the forthcoming attractive markets within the e-beam wafer inspection industry
  • Market fuelers, market impediments, and their impact on market growth
  • in-depth competitive environment analysis
  • Trailing 2-year market size data (2015–2016)
  • SRC (Segment, Region, Country) Analysis

Overall, the research study provides a holistic view of the global e-beam wafer inspection system market, offering market size and estimates for the period from 2017 to 2025, keeping in mind the above-mentioned factors.

Based on geography, the global e-beam wafer inspection system market is segmented into the following regions and countries:

  • North America
  • U.S.
  • Canada
  • Europe
  • U.K.
  • Germany
  • France
  • Rest of Europe
  • Asia Pacific
  • Japan
  • China
  • South Asia
  • Rest of Asia Pacific
  • Rest of the World (RoW)
  • Middle East and Africa (MEA)
  • Latin America

As of 2016, the overall e-beam wafer inspection system market worldwide is dominated by the Asia Pacific region. The segment contributed to more than forty percent of the total revenue generated in 2016.

The most significant factor contributing to the large revenue share is the huge semiconductor and electronics industry in the region. The market here is largely governed by China, Japan, South Korea, and some Southeast Asian countries, all of which have vast presences in the overall electronics industry. India, too is increasingly becoming lucrative for e-beam wafer inspection systems due to the rising electronics manufacturing industry here.

Europe and North America follow the Asia Pacific, in terms of revenue, in the global e-beam wafer inspection systems market. Europe comprises a large number of electronics and semiconductor manufacturing companies, thereby supporting market growth.

Subsequently, the market would continue to register robust growth during the forecast period. Nevertheless, Asia Pacific is estimated to retain its dominant position in the market throughout the forecast period.

Frequently Asked Question:

The market for E-Beam Wafer Inspection System Market is expected to reach USD$ 700 Mn in 2025.

The E-Beam Wafer Inspection System Market is expected to see significant CAGR growth over the coming years, at XX%.

The report is forecasted from 2017 -2025.

The base year of this report is 2016.

ASML Holding NV, Applied Materials, Inc., KLA-Tencor Corporation, Lam Research Corporation, NXP Semiconductors NV.are of the major players in the global market.

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Published Date:  Apr 2017
Category:  Semiconductor & Electronics
Report ID:   58433
Report Format:   PDF
Pages:   120
Rating:    4.7 (80)
Delivery Time: 24 Hours to 48 Hours   
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