| REPORT ATTRIBUTE |
DETAILS |
| Historical Period |
2019-2022 |
| Base Year |
2023 |
| Forecast Period |
2024-2032 |
| Surface Mount Technology Market Size 2023 |
USD 6.50 Billion |
| Surface Mount Technology Market, CAGR |
7.10% |
| Surface Mount Technology Market Size 2032 |
USD 12.24 Billion |
Market Overview:
The Surface Mount Technology (SMT) market is experiencing steady growth, projected to reach USD 12.24 billion by 2032 from USD 6.50 billion in 2023, at a CAGR of 7.10%.
The demand for Surface Mount Technology (SMT) stems from the electronics industry’s relentless drive towards miniaturization, aiming to produce smaller and lighter devices. SMT facilitates the precise placement of tiny electronic components on printed circuit boards (PCBs), a necessity in devices such as smartphones, wearables, and Internet of Things (IoT) gadgets. Compared to traditional through-hole technology, SMT offers enhanced efficiency and productivity, enabling faster production lines, higher component density on PCBs, and stronger solder joints, thus contributing to cost reduction in electronics manufacturing.
Continuous technological advancements in robotics, placement equipment, and inspection technologies are further propelling the adoption of SMT. This progress enhances the accuracy and speed of SMT processes, while the development of new materials and components tailored for SMT expands its capabilities. Geographically, Asia Pacific leads the SMT market, driven by its established electronics manufacturing base and growing domestic demand. Major players like Samsung, Intel, and Foxconn, alongside equipment manufacturers such as Yamaha Motor Company and ASM International N.V., continuously innovate to offer more efficient and cost-effective SMT solutions. As the miniaturization trend continues, along with increasing automation and the expansion of the IoT market, the SMT market is poised for sustained growth, potentially spurred further by advancements in sustainable SMT solutions amidst environmental concerns regarding e-waste.
Access crucial information at unmatched prices!
Request your free sample report today & start making informed decisions powered by Credence Research!
Download Free Sample
Market Drivers:
Rising Demand for Miniaturization:
The relentless pursuit of smaller and more powerful electronic devices is a major driver for SMT. SMT components are significantly smaller and lighter than traditional through-hole components, allowing manufacturers to pack more functionality into a compact space. This trend is particularly evident in mobile phones, wearables, and other consumer electronics, where size and portability are key selling points. For instance, the latest iPhone model is 70% smaller and 40% lighter than the first generation iPhone, thanks to SMT.
Increased Efficiency and Automation:
SMT streamlines the manufacturing process by automating component placement and soldering. This translates to faster production times, higher assembly accuracy, and reduced labor costs compared to through-hole technology. As manufacturers strive for greater efficiency and cost-effectiveness, SMT becomes an increasingly attractive option. For instance, a leading electronics manufacturer reported a 30% increase in production efficiency after switching to SMT.
Improved Component Versatility:
Advancements in materials science and manufacturing techniques are leading to the development of a wider range of high-quality SMT components. This includes complex integrated circuits, passive components like resistors and capacitors, and even microelectromechanical systems (MEMS). For instance, the latest smartphones feature SMT-based MEMS sensors for applications like motion tracking and heart rate monitoring.
Expanding Applications Beyond Traditional Electronics:
The benefits of SMT are not limited to consumer electronics. The technology is increasingly finding applications in the automotive, aerospace, and medical device industries. For instance, SMT is used in car engine control units, avionics systems, and pacemakers, where miniaturization, reliability, and precise assembly are crucial. This diversification into new sectors is contributing significantly to the overall growth of the SMT market.
Market Trends:
Miniaturization and Integration:
The ongoing push for smaller, lighter, and more feature-rich electronic devices necessitates the use of miniaturized electronic components. Surface Mount Technology (SMT) excels in this area, as it allows for the placement of tiny surface mount components (SMCs) on printed circuit boards (PCBs). This miniaturization trend not only reduces device size and weight but also enables higher functionality and processing power within compact devices. For instance, the semiconductor industry has followed Moore’s law, cutting the size of integrated circuits in half every two years. This remarkable feat of miniaturization has brought ever-smarter electronics into all kinds of devices, from mobile phones to electric vehicles to data centers.
Rising Demand for Consumer Electronics and Internet of Things (IoT):
The ever-growing popularity of consumer electronics like smartphones, tablets, and wearable devices creates a significant demand for SMT solutions. Additionally, the burgeoning Internet of Things (IoT) landscape, with its vast network of interconnected devices, further fuels the need for efficient and high-density PCB assembly techniques that SMT excels at. For example, smart home devices, a subset of IoT, are becoming increasingly popular. These trends indicate a significant demand for Surface Mount Technology (SMT) solutions, as both consumer electronics and IoT devices become increasingly sophisticated and require more complex functionalities. The efficient and high-density PCB assembly techniques that SMT excels at will continue to be crucial in meeting this demand.
Market Challenges Analysis:
High Initial Investment and Thermal Management Concerns:
Implementing SMT production lines requires a significant upfront investment in specialized equipment and machinery. This can be a hurdle for smaller manufacturers or those transitioning from traditional through-hole technology (THT). Additionally, the miniaturization of electronic components and increasing chip power densities necessitate effective thermal management solutions within SMT assemblies. Ensuring proper heat dissipation within compact spaces requires careful design considerations and potentially additional components, impacting overall production costs.
Challenges in Repair and Rework:
SMT components are often smaller and more delicate than their THT counterparts. This presents difficulties in rework and repair processes, especially for densely populated printed circuit boards (PCBs). Desoldering and resoldering SMT components can be time-consuming and require specialized skills and equipment. Furthermore, the high heat involved in these processes can damage surrounding components, leading to increased scrap rates and production delays.
Segmentation Analysis:
By Application:
The application of Surface Mount Technology (SMT) spans across various industries, driven by the need for miniaturization and efficient electronic component assembly. In consumer electronics, including smartphones, televisions, and various gadgets, SMT plays a crucial role due to its ability to accommodate high production volumes and intricate designs. Automotive electronics leverage SMT for the integration of safety, entertainment, and control systems in vehicles, reflecting the increasing reliance on electronics in modern cars. Industrial applications, such as automation and robotics, also benefit from SMT for assembling reliable and robust electronic components. In the healthcare sector, advancements in medical devices and wearables present opportunities for SMT integration, contributing to the development of innovative healthcare solutions. Moreover, the SMT market caters to a diverse array of other applications, including aerospace, defense, telecommunication, and beyond, highlighting its versatility and widespread adoption across various industries.
By Equipment :
The SMT equipment market encompasses various segments crucial for the efficient assembly and quality assurance of electronic components onto printed circuit boards (PCBs). Inspection equipment, including automated optical inspection (AOI) machines and X-ray inspection systems, ensures the quality and accuracy of SMT assembly, aligning with the industry’s focus on defect prevention and first-pass yield improvement. Placement equipment, the largest segment, involves high-speed pick-and-place machines and multi-head placement systems, facilitating precise positioning of electronic components onto PCBs, driven by advancements in automation and component miniaturization. Soldering equipment, covering reflow ovens and wave soldering machines, responds to the increasing demand for lead-free soldering processes and high-density PCBs. Screen printing equipment, though maturing, remains essential for stenciling solder paste onto PCBs. Cleaning equipment addresses the need for flux residue and contaminant removal post-soldering, driven by stringent environmental regulations. Finally, repair and rework equipment are vital for rectifying faulty SMT assemblies, particularly as electronic components become more complex and miniaturized, underscoring the importance of precise rework tools and techniques in ensuring product integrity and performance.
Segments:
Based on Equipment :
- Inspection Equipment
- Placement Equipment
- Soldering Equipment
- Screen Printing Equipment
- Cleaning Equipment
- Repair & Rework Equipment
Based on Service :
- Designing
- Test & Prototyping
- Supply Chain Services
- Manufacturing
- Aftermarket Services
Based on Application :
- Consumer Electronics
- Home Appliances
- Audio and Video Systems
- Storage Devices
- Others
- IT & telecommunication
- Telecom Equipment
- Networking Devices
- Automotive
- Driver Assistance Systems
- Infotainment Systems
- Others
- Industrial
- Industrial Automation and Motion Control
- Mechatronics and Robotics
- Power Electronics
- Photovoltaic Systems
- Others
- Aerospace & Defense
- Aircraft Systems
- Military Radars
- Others
- Healthcare
- Medical Imaging Equipment
- Consumer Medical Devices
- Others
- Others
Based on Regional :
- North America
- Europe
- The U.K.
- Germany
- France
- Spain
- Italy
- Asia-Pacific
- China
- Japan
- India
- Taiwan
- Australia
- Latin America
- Middle East & Africa
Regional Analysis:
Asia Pacific:
The Asia Pacific region dominates the global Surface Mount Technology market, accounting for a substantial share of around 60%. This region’s prominence can be attributed to several factors, including the presence of major electronics manufacturing hubs, a vast consumer electronics market, and the increasing adoption of advanced electronics assembly techniques.Within Asia Pacific, China holds the largest market share, driven by its massive electronics manufacturing capabilities and the growing demand for consumer electronics products. Other significant contributors to the region’s market share include Japan, South Korea, and Taiwan, which are home to leading semiconductor and electronics companies.
North America:
North America represents the second-largest regional market for Surface Mount Technology, capturing a market share of approximately 25%. The United States leads the way in this region, fueled by its well-established electronics industry, the presence of major technology companies, and the demand for advanced electronics assembly solutions across various sectors, including aerospace, defense, and automotive.The North American market is characterized by a strong focus on innovation, automation, and the adoption of cutting-edge SMT techniques. The region’s emphasis on high-reliability electronics and stringent quality standards has further driven the demand for advanced surface mount technology solutions.
Shape Your Report to Specific Countries or Regions & Enjoy 30% Off!
Key player:
- ASM Pacific Technology
- Seika Corporation
- Panasonic
- Teradyne Inc.
- Mycronic
- Kulicke & Soffa Industries, Inc.
- Neoden SMT
- Nordson Corporation
- Cognex Corporation
- Fuji Machine Manufacturing Co., Ltd.
Competitive Analysis:
The Surface Mount Technology (SMT) market features a competitive landscape with several leading players vying for market share. Established giants like Panasonic, ASM Assembly Systems, Mycronic, and Juki Corporation hold a strong foothold due to their extensive product portfolios, global reach, and well-established reputations. However, competition is intensifying with the emergence of Asian manufacturers like Yamaha Motor and NeoDen, who offer cost-effective solutions. Additionally, companies like Nordson Corporation and Koh Young Technology focus on specific segments within SMT, providing specialized equipment and catering to niche markets. This mix of established players, regional powerhouses, and niche specialists keeps the SMT market dynamic, driving innovation and cost optimization in SMT equipment and processes.
Recent Developments:
In February 2023, Yamaha Motors launched a new YRM20DL surface mounter, a premium high-efficiency modular that achieves improved actual and per-unit-area productivity with a high-rigidity dual-lane conveyor, further reducing transport losses.
In December 2022, Mycronic AB received an order for a Precision 800 Evo mask writer for display applications from an existing customer in Asia. Delivery of the system is planned for the second quarter of 2024.
In December 2022, Linx Technologies (Linx), now part of TE Connectivity, a developer and manufacturer of antennas and connectors, expands upon our Splatch antennas series with the release of a new surface-mount embedded global navigation satellite system (GNSS) antenna supporting GPS, Galileo, GLONASS, Beidou and QZSS systems in the L1/E1/B1 bands. The new linear GNSS antenna from Linx expands upon its already robust embedded PCB antenna portfolio of customer favorites like the uSP410, the SP610, and the nSP250, by adding a global navigation satellite system (GNSS) solution
In May 2022, Summit Interconnect acquired Royal Circuit Solutions and Affiliates. With eight manufacturing facilities added to their footprint as a result of the merger, Summit is now one of the largest privately held printed circuit board (PCB) producers in North America, which raises the demand for SMT in the area. The acquisition greatly broadens Summit’s product line while also increasing the company’s business portfolio of important clients and end markets.
Market Concentration & Characteristics:
The Surface Mount Technology (SMT) market showcases a characteristically consolidated landscape. A small number of dominant electronics manufacturing service (EMS) providers and electronic component manufacturers hold a significant share of the market. These major players are complemented by a network of specialized SMT equipment and materials suppliers, forming a comprehensive ecosystem. This market structure fosters economies of scale and facilitates efficient production processes. However, it can also limit competition and hinder the pace of disruptive innovation to some extent.
Report Coverage:
The research report offers an in-depth analysis based on Equipment, Service, Application, and Regional. It details leading market players, providing an overview of their business, product offerings, investments, revenue streams, and key applications. Additionally, the report includes insights into the competitive environment, SWOT analysis, current market trends, as well as the primary drivers and constraints. Furthermore, it discusses various factors that have driven market expansion in recent years. The report also explores market dynamics, regulatory scenarios, and technological advancements that are shaping the industry. It assesses the impact of external factors and global economic changes on market growth. Lastly, it provides strategic recommendations for new entrants and established companies to navigate the complexities of the market.
Future Outlook:
- As electronic devices continue to shrink in size, the demand for even smaller and more densely packed SMT components will surge. This will drive advancements in miniaturization techniques and high-precision placement equipment.
- The adoption of novel materials like ceramics and flexible substrates will enable the creation of SMT components with improved heat dissipation, flexibility, and performance for specialized applications.
- The trend towards combining different types of components (e.g., integrated circuits, sensors, passives) within a single SMT package is expected to gain traction, leading to more compact and multifunctional electronic devices.
- AI and ML algorithms will optimize SMT processes by identifying and resolving soldering defects more accurately and efficiently. Additionally, they’ll enable predictive maintenance, anticipating equipment failures and scheduling preventative measures to minimize downtime, while also optimizing process parameters for improved quality and yield.
- Environmental concerns will drive the development of lead-free and other environmentally friendly SMT materials and processes. Additionally, advancements in recycling and reusing SMT components will gain importance.
- SMT is expected to see increased adoption beyond traditional electronics sectors like consumer electronics and telecommunications. This includes applications in automotive, aerospace, medical devices, and wearable electronics.
- The trend of relocating manufacturing facilities closer to consumer markets to reduce transportation costs and improve supply chain resilience is likely to benefit the SMT market in certain regions.
- Integration of SMT equipment with smart factory technologies like Industrial Internet of Things (IIoT) will enable real-time data collection, process monitoring, and remote control for enhanced production efficiency and flexibility.
- As SMT production lines become increasingly automated and interconnected, ensuring cybersecurity measures are in place to safeguard against cyberattacks will be crucial.
- Advancements in packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and System-in-Package (SiP) will offer opportunities for increased functionality and miniaturization within SMT assemblies.
