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Passive and Interconnecting Components Market By Component (Passive Components and Interconnecting Components), By Application (Automotive, Aerospace & Defense, Consumer Electronics, Healthcare, Industrial, IT & Telecom, and Others) – Growth, Future Prospects and Competitive Landscape, 2019 – 2027

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Published: | Report ID: 8825 | Report Format : PDF

The global passive and interconnecting components market was valued at US$ 168.8 Bn in 2018 and is expected to grow significantly, expanding at a CAGR of 5.1% from 2019 to 2027. Electronic components form an important part of electronic circuitry. These components are used increasingly in several industries, including medical electronics, automotive, aerospace, and defense, etc., and are of great importance in the telecommunications and consumer electronics sectors.

Technological advancements have led to multifaceted circuitry that offers high functionality and easy adoption in a wide range of applications. Growing trends toward highly efficient electronic components and optimization of processes in terms of cost and energy savings have led to an increase in advancements in the electronics sector. As a result, continual innovation and the introduction of advanced technologies in the consumer electronics sector are thereby supplementing the growth of the overall passive and interconnecting components market worldwide.

Market Snapshot

Interconnecting Components Garnered the Largest Market Share in 2018

In 2018, interconnecting components garnered the largest market share in the global passive and interconnecting components market. The segment is likely to grow at a substantial rate during the forecast period from 2019 to 2027. Interconnect is the mechanical and electrical connections between two or more terminals that connect the device together. These components consist mainly of printed circuit boards, connectors, switches, etc.

Interconnects are mainly used for connecting every passive component and are responsible for the flow of current between two conductors and electric circuits. Interconnecting components are of great importance in many modern electronic systems. The growing adoption of interconnects across various end-use industry verticals is expected to enhance the growth of this segment in the coming years.

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Asia Pacific to Continue its Supremacy during the Forecast Period from 2019 to 2026

In terms of geography, Asia Pacific led the global market for passive and interconnecting components in 2018. The region is expected to continue its dominance and have the upper hand in the market. The presence of strong semiconductor and electronic companies such as Fujitsu Component Limited, Foxconn Technology Group, Hirose Electric Co., Ltd., etc., is providing diverse business opportunities to the regional passive and interconnecting components market throughout the forecast period from 2019 to 2027.

Competitive Insights

The major players identified in the passive and interconnecting components market include TE Connectivity, Amphenol Corporation, Hirose Electric Co., Ltd., Fujitsu Component Limited, Molex, LLC, TTI, Inc., TT Electronics Plc., AVX Corporation, Foxconn Technology Group (Hon Hai), Burndy LLC, Panasonic Corporation, 3M, KYOCERA Corporation, and YAGEO Corporation, among others. These players are incessantly focusing on strengthening their product portfolio in order to cater to the rising needs of their customers. New product development, product innovation, and partnerships remain some of the major strategies adopted by the leading players to have the edge over their counterparts.

Periods of History and Forecast

The research report presents the analysis of each segment from 2017 to 2027, considering 2018as the base year for the research. The compound annual growth rate (CAGR) for each of the respective segments is calculated for the forecast period from 2019 to 2027.

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Report Scope by Segments

The passive and interconnecting components market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of the global passive and interconnecting components market based on product type, application, and geography. Key segments covered in the report are as follows:

Key questions are answered in this report.

  • What was the size of the market for passive and interconnecting components in 2018, and what is the forecast up to 2027?
  • What are the key factors driving the global market for passive and interconnecting components?
  • What are the key market trends and high-growth opportunities observed in the passive and interconnecting components market?
  • What are the drivers of the market for passive and interconnecting components?
  • Which is the largest regional market for passive and interconnecting components?
  • Which segment will grow at a faster pace? Why?
  • Which region will drive the market’s growth? Why?
  • Which players are leading the passive and interconnecting components market?
  • What are the sustainability strategies adopted by the key players operating in the market?

1. Preface
1.1. Report Description
1.1.1. Purpose of the Report
1.1.2. Target Audience
1.1.3. USP and Key Offerings
1.2. Research Scope
1.3. Research Methodology
1.3.1. Phase I – Secondary Research
1.3.2. Phase II – Primary Research
1.3.3. Phase III – Expert Panel Review
1.3.4. Approach Adopted
1.3.4.1. Top-Down Approach
1.3.4.2. Bottom-Up Approach
1.3.5. Assumptions
1.4. Market Segmentation

2. Executive Summary
2.1. Market Snapshot: Global PIC Market
2.2. Global PIC Market, by Product Type, 2018 (US$ Bn)
2.3. Global PIC Market, by Application, 2018 (US$ Bn)
2.4. Global PIC Market, by Geography, 2018 (US$ Bn)

3. Market Dynamics
3.1. Introduction
3.1.1. Global PIC Market Value, 2017-2027, (US$ Bn)
3.2. Market Dynamics
3.2.1. Market Drivers
3.2.2. Market Restraints
3.3. Attractive Investment Proposition, by Geography, 2018
3.4. Market Positioning of Key Players, 2018
3.4.1. Major Strategies Adopted by Key Players

4. Global Passive and Interconnecting Components (PIC) Market, by Product Type , 2017-2027 (US$ Bn)
4.1. Overview
4.2. Passive Components
4.2.1. Resistors
4.2.2. Capacitors
4.2.3. Transformers
4.2.4. Others (Diodes, Inductors, etc.)
4.3. Interconnecting Components
4.3.1. Printed Circuit Boards
4.3.2. Connectors
4.3.3. Switches
4.3.4. Others (Relays, Fuses, etc.)

5. Global Passive and Interconnecting Components (PIC) Market, by Application, 2017-2027 (US$ Bn)
5.1. Overview
5.2. Automotive
5.3. Aerospace & Defense
5.4. Consumer Electronics
5.5. Healthcare
5.6. Industrial
5.7. IT & Telecom
5.8. Others

6. North America Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
6.1. Overview
6.1.1. North America PIC Market Value and Growth, 2017-2027, (US$ Bn)
6.2. North America PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
6.2.1. Market Analysis
6.3. North America PIC Market Value, By Application, 2017-2027 (US$ Bn)
6.3.1. Market Analysis
6.4. North America PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
6.4.1. Market Analysis
6.4.2. U.S.
6.4.3. Rest of North America

7. Europe Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
7.1. Overview
7.1.1. Europe PIC Market Value and Growth, 2017-2027, (US$ Bn)
7.2. Europe PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
7.2.1. Market Analysis
7.3. Europe PIC Market Value, By Application, 2017-2027 (US$ Bn)
7.3.1. Market Analysis
7.4. Europe PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
7.4.1. Market Analysis
7.4.2. U.K.
7.4.3. Germany
7.4.4. France
7.4.5. Rest of Europe

8. Asia Pacific Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
8.1. Overview
8.1.1. Asia Pacific PIC Market Value and Growth, 2017-2027, (US$ Bn)
8.2. Asia Pacific PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
8.2.1. Market Analysis
8.3. Asia Pacific PIC Market Value, By Application, 2017-2027 (US$ Bn)
8.3.1. Market Analysis
8.4. Asia Pacific PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
8.4.1. Market Analysis
8.4.2. Japan
8.4.3. China
8.4.4. India
8.4.5. Rest of Asia Pacific

9. Rest of the World Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
9.1. Overview
9.1.1. Rest of the World PIC Market Value and Growth, 2017-2027, (US$ Bn)
9.2. Rest of the World PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
9.2.1. Market Analysis
9.3. Rest of the World PIC Market Value, By Application, 2017-2027 (US$ Bn)
9.3.1. Market Analysis
9.4. Rest of the World PIC Market Value, By Region, 2017-2027 (US$ Bn)
9.4.1. Market Analysis
9.4.2. Middle East & Africa
9.4.3. Latin America

10. Company Profiles
10.1. TE Connectivity
10.2. Amphenol Corporation
10.3. Hirose Electric Co., Ltd.
10.4. Fujitsu Component Limited
10.5. Molex, LLC
10.6. TTI, Inc.
10.7. TT Electronics Plc.
10.8. AVX Corporation
10.9. Foxconn Technology Group
10.10. Burndy LLC
10.11. Panasonic Corporation
10.12. 3M
10.13. KYOCERA Corporation
10.14. YAGEO Corporation

List of Figures

FIG. 1 Global Passive and Interconnecting Components (PIC) Market: Research Methodology
FIG. 2 Market Size Estimation – Top-Down and Bottom Up Approach
FIG. 3 Global PIC Market Segmentation
FIG. 4 Global PIC Market, by Product Type, 2018 (US$ Bn)
FIG. 5 Global PIC Market, by Application, 2018 (US$ Bn)
FIG. 6 Global PIC Market, by Geography, 2018 (US$ Bn)
FIG. 7 Global PIC Market Value, 2017-2027, (US$ Bn) and (Y-o-Y%)
FIG. 8 Attractive Investment Proposition, by Geography, 2018
FIG. 9 Global Market Positioning of Key PIC Providers, 2018
FIG. 10 Global PIC Market Value Share, by Product Type, 2018 & 2027 (Value %)
FIG. 11 Global Passive Components Market Value, 2017-2027, (US$ Bn)
FIG. 12 Global Interconnecting Components Market Value, 2017-2027, (US$ Bn)
FIG. 13 Global PIC Market Value Share, by Application, 2018 & 2027 (Value %)
FIG. 14 Global PIC Market Value for Automotive, 2017-2027, (US$ Bn)
FIG. 15 Global PIC Market Value for Aerospace & Defense, 2017-2027, (US$ Bn)
FIG. 16 Global PIC Market Value for Consumer Electronics, 2017-2027, (US$ Bn)
FIG. 17 Global PIC Market Value for Healthcare, 2017-2027, (US$ Bn)
FIG. 18 Global PIC Market Value for Industrial, 2017-2027, (US$ Bn)
FIG. 19 Global PIC Market Value for IT & Telecom, 2017-2027, (US$ Bn)
FIG. 20 Global PIC Market Value for Others, 2017-2027, (US$ Bn)
FIG. 21 North America PIC Market Value, 2017-2027, (US$ Bn)
FIG. 22 Europe PIC Market Value, 2017-2027, (US$ Bn)
FIG. 23 Asia Pacific PIC Market Value, 2017-2027, (US$ Bn)
FIG. 24 RoW PIC Market Value, 2017-2027, (US$ Bn)

List of Tables

TABLE 1 Market Snapshot: Global Passive and Interconnecting Components (PIC) Market Value
TABLE 2 Impact Indicators
TABLE 3 Impact Analysis of Drivers and Restraints
TABLE 4 Global PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 5 Global PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 6 Global PIC Market, by End-use Vertical, 2017 – 2027 (US$ Bn)
TABLE 7 Global PIC Market, by Geography, 2017-2027 (US$ Bn)
TABLE 8 North America PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 9 North America PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 10 North America PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 11 Europe PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 12 Europe PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 13 Europe PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 14 Asia Pacific PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 15 Asia Pacific PIC Market, by Application, 2017 -2027 (US$ Bn)
TABLE 16 Asia Pacific PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 17 Rest of the World PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 18 Rest of the World PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 19 Rest of the World PIC Market Value, by Region, 2017-2027 (US$ Bn)
TABLE 20 TE Connectivity: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 21 Amphenol Corporation.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 22 Hirose Electric Co. Ltd.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 23 Fujitsu Component Limited: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 24 Molex, LLC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 25 TTI, Inc.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 26 TT Electronics Plc.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 27 AVX Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 28 Foxconn Technology Group: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 29 Burndy LLC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 30 Panasonic Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 31 3M: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 32 KYOCERA Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 33 YAGEO Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)

Frequently Asked Question:

What is the size of Passive and Interconnecting Components Market?

The market for Passive and Interconnecting Components Market is expected to reach USD$ 168.8 Bn in 2027.

What is the Passive and Interconnecting Components Market CAGR?

The Passive and Interconnecting Components Market is expected to see significant CAGR growth over the coming years, at 5.1%.

What is the Forecast period considered for Passive and Interconnecting Components Market?

The report is forecasted from 2019 -2027.

What is the base year considered for Passive and Interconnecting Components Market?

The base year of this report is 2018.

Who are the major players in this market?

Amphenol Corporation, Hirose Electric Co., Ltd., Fujitsu Component Limited, Molex, LLC, TTI. are some of the major players in the global market.

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