Passive and Interconnecting Components Market By Component (Passive Components and Interconnecting Components), By Application (Automotive, Aerospace & Defense, Consumer Electronics, Healthcare, Industrial, IT & Telecom, and Others) - Growth, Future Prospects and Competitive Landscape, 2019 – 2027

Overview:                      

The global passive and interconnecting components market was valued at US$ 168.8 Bn in 2018 and is projected to witness noteworthy growth, expanding at a CAGR of 5.1% during the forecast period from 2019 to 2027. Electronic components form an important part of electronic circuitry. These components are used increasingly in several industries including medical electronics, automotive, aerospace & defense, etc. and are of great importance in the telecommunications and consumer electronics sector. Technological advancements have steered multifaceted circuitry that offers high functionality and easy adoption in wide range of applications. Growing trends of highly efficient electronic components and optimization of processes in terms of costs and energy saving have led to the increase in advancements in the electronics sector. As a result, continual innovation and introduction of advanced technologies in the consumer electronics sector is thereby supplementing the growth of the overall passive and interconnecting components market worldwide. 

Market Snapshot 

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"Interconnecting Components Garnered Largest Market Share in 2018"

In 2018, interconnecting components garnered largest market share in the global passive and interconnecting components market. The segment is likely to grow at a substantial rate during the forecast period from 2019 to 2027. Interconnect is the mechanical and electrical connectivity between two or more terminals that connects the device together. These components mainly comprises of printed circuit boards, connectors, switches, etc. Interconnects are mainly used for connecting every passive component and are responsible for the flow of current between two conductors and electric circuits.  Interconnecting components are of great importance in many modern electronic systems. Growing adoption of interconnects across various end-use industry verticals is expected to enhance the growth of this segment in the coming years.

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"Asia Pacific to Continue its Supremacy during the Forecast Period from 2019 to 2026"

The global passive and interconnecting components market, based on geography was led by Asia Pacific in 2018. The region is expected to continue with its dominance and have an upper hand in the market. The presence of strong semiconductors and electronic companies such as Fujitsu Component Limited, Foxconn Technology Group, Hirose Electric Co., Ltd., etc. are providing diverse business opportunities to the regional passive and interconnecting components market throughout the forecast period from 2019 to 2027.     

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Competitive Insights

The major players identified in the passive and interconnecting components market include TE Connectivity, Amphenol Corporation, Hirose Electric Co., Ltd., Fujitsu  Component Limited, Molex, LLC, TTI, Inc., TT Electronics Plc., AVX Corporation, Foxconn Technology Group (Hon Hai), Burndy LLC, Panasonic Corporation, 3M, KYOCERA Corporation, and YAGEO Corporation among others. These players are incessantly focusing on strengthening their product portfolio in order to cater the rising needs of the customers. New product development, product innovation and partnerships remains some of the major strategies adopted by the leading players to have an edge over their counterparts.

Historical & Forecast Period

The research report presents the analysis of each segment from 2017 to 2027 considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segments calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

Passive and interconnecting components market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of global passive and interconnecting components market based on product type, application, and geography. Key segments covered in the report are as follows: 

Key questions answered in this report

• What was the market size of passive and interconnecting components market in 2018 and forecast up to 2027?
• What are the key factors driving the global passive and interconnecting components market?
• What are the key market trends and high-growth opportunities observed in the passive and interconnecting components market?
• What are the drivers of the passive and interconnecting components market?
• Which is the largest regional market for passive and interconnecting components market?
• Which segment will grow at a faster pace? Why?
• Which region will drive the market growth? Why?
• Which players are leading the passive and interconnecting components market?
• What are the sustainability strategies adopted by the key players operating in the market?

1. Preface
1.1. Report Description
1.1.1. Purpose of the Report
1.1.2. Target Audience
1.1.3. USP and Key Offerings
1.2. Research Scope
1.3. Research Methodology
1.3.1. Phase I – Secondary Research
1.3.2. Phase II – Primary Research
1.3.3. Phase III – Expert Panel Review
1.3.4. Approach Adopted
1.3.4.1. Top-Down Approach
1.3.4.2. Bottom-Up Approach
1.3.5. Assumptions
1.4. Market Segmentation

2. Executive Summary
2.1. Market Snapshot: Global PIC Market
2.2. Global PIC Market, by Product Type, 2018 (US$ Bn)
2.3. Global PIC Market, by Application, 2018 (US$ Bn)
2.4. Global PIC Market, by Geography, 2018 (US$ Bn)

3. Market Dynamics
3.1. Introduction
3.1.1. Global PIC Market Value, 2017-2027, (US$ Bn)
3.2. Market Dynamics
3.2.1. Market Drivers
3.2.2. Market Restraints
3.3. Attractive Investment Proposition, by Geography, 2018
3.4. Market Positioning of Key Players, 2018
3.4.1. Major Strategies Adopted by Key Players

4. Global Passive and Interconnecting Components (PIC) Market, by Product Type , 2017-2027 (US$ Bn)
4.1. Overview
4.2. Passive Components
4.2.1. Resistors
4.2.2. Capacitors
4.2.3. Transformers
4.2.4. Others (Diodes, Inductors, etc.)
4.3. Interconnecting Components
4.3.1. Printed Circuit Boards
4.3.2. Connectors
4.3.3. Switches
4.3.4. Others (Relays, Fuses, etc.)

5. Global Passive and Interconnecting Components (PIC) Market, by Application, 2017-2027 (US$ Bn)
5.1. Overview
5.2. Automotive
5.3. Aerospace & Defense
5.4. Consumer Electronics
5.5. Healthcare
5.6. Industrial
5.7. IT & Telecom
5.8. Others

6. North America Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
6.1. Overview
6.1.1. North America PIC Market Value and Growth, 2017-2027, (US$ Bn)
6.2. North America PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
6.2.1. Market Analysis
6.3. North America PIC Market Value, By Application, 2017-2027 (US$ Bn)
6.3.1. Market Analysis
6.4. North America PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
6.4.1. Market Analysis
6.4.2. U.S.
6.4.3. Rest of North America

7. Europe Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
7.1. Overview
7.1.1. Europe PIC Market Value and Growth, 2017-2027, (US$ Bn)
7.2. Europe PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
7.2.1. Market Analysis
7.3. Europe PIC Market Value, By Application, 2017-2027 (US$ Bn)
7.3.1. Market Analysis
7.4. Europe PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
7.4.1. Market Analysis
7.4.2. U.K.
7.4.3. Germany
7.4.4. France
7.4.5. Rest of Europe

8. Asia Pacific Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
8.1. Overview
8.1.1. Asia Pacific PIC Market Value and Growth, 2017-2027, (US$ Bn)
8.2. Asia Pacific PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
8.2.1. Market Analysis
8.3. Asia Pacific PIC Market Value, By Application, 2017-2027 (US$ Bn)
8.3.1. Market Analysis
8.4. Asia Pacific PIC Market Value, By Region/Country, 2017-2027 (US$ Bn)
8.4.1. Market Analysis
8.4.2. Japan
8.4.3. China
8.4.4. India
8.4.5. Rest of Asia Pacific

9. Rest of the World Passive and Interconnecting Components (PIC) Market Analysis, 2017-2027 (US$ Bn)
9.1. Overview
9.1.1. Rest of the World PIC Market Value and Growth, 2017-2027, (US$ Bn)
9.2. Rest of the World PIC Market Value, By Product Type, 2017-2027 (US$ Bn)
9.2.1. Market Analysis
9.3. Rest of the World PIC Market Value, By Application, 2017-2027 (US$ Bn)
9.3.1. Market Analysis
9.4. Rest of the World PIC Market Value, By Region, 2017-2027 (US$ Bn)
9.4.1. Market Analysis
9.4.2. Middle East & Africa
9.4.3. Latin America

10. Company Profiles
10.1. TE Connectivity
10.2. Amphenol Corporation
10.3. Hirose Electric Co., Ltd.
10.4. Fujitsu Component Limited
10.5. Molex, LLC
10.6. TTI, Inc.
10.7. TT Electronics Plc.
10.8. AVX Corporation
10.9. Foxconn Technology Group
10.10. Burndy LLC
10.11. Panasonic Corporation
10.12. 3M
10.13. KYOCERA Corporation
10.14. YAGEO Corporation

* Here we are using PIC as a short form of Passive and Interconnecting Components

FIG. 1 Global Passive and Interconnecting Components (PIC) Market: Research Methodology
FIG. 2 Market Size Estimation – Top-Down and Bottom Up Approach
FIG. 3 Global PIC Market Segmentation
FIG. 4 Global PIC Market, by Product Type, 2018 (US$ Bn)
FIG. 5 Global PIC Market, by Application, 2018 (US$ Bn)
FIG. 6 Global PIC Market, by Geography, 2018 (US$ Bn)
FIG. 7 Global PIC Market Value, 2017-2027, (US$ Bn) and (Y-o-Y%)
FIG. 8 Attractive Investment Proposition, by Geography, 2018
FIG. 9 Global Market Positioning of Key PIC Providers, 2018
FIG. 10 Global PIC Market Value Share, by Product Type, 2018 & 2027 (Value %)
FIG. 11 Global Passive Components Market Value, 2017-2027, (US$ Bn)
FIG. 12 Global Interconnecting Components Market Value, 2017-2027, (US$ Bn)
FIG. 13 Global PIC Market Value Share, by Application, 2018 & 2027 (Value %)
FIG. 14 Global PIC Market Value for Automotive, 2017-2027, (US$ Bn)
FIG. 15 Global PIC Market Value for Aerospace & Defense, 2017-2027, (US$ Bn)
FIG. 16 Global PIC Market Value for Consumer Electronics, 2017-2027, (US$ Bn)
FIG. 17 Global PIC Market Value for Healthcare, 2017-2027, (US$ Bn)
FIG. 18 Global PIC Market Value for Industrial, 2017-2027, (US$ Bn)
FIG. 19 Global PIC Market Value for IT & Telecom, 2017-2027, (US$ Bn)
FIG. 20 Global PIC Market Value for Others, 2017-2027, (US$ Bn)
FIG. 21 North America PIC Market Value, 2017-2027, (US$ Bn)
FIG. 22 Europe PIC Market Value, 2017-2027, (US$ Bn)
FIG. 23 Asia Pacific PIC Market Value, 2017-2027, (US$ Bn)
FIG. 24 RoW PIC Market Value, 2017-2027, (US$ Bn)

TABLE 1 Market Snapshot: Global Passive and Interconnecting Components (PIC) Market Value
TABLE 2 Impact Indicators
TABLE 3 Impact Analysis of Drivers and Restraints
TABLE 4 Global PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 5 Global PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 6 Global PIC Market, by End-use Vertical, 2017 - 2027 (US$ Bn)
TABLE 7 Global PIC Market, by Geography, 2017-2027 (US$ Bn)
TABLE 8 North America PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 9 North America PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 10 North America PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 11 Europe PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 12 Europe PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 13 Europe PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 14 Asia Pacific PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 15 Asia Pacific PIC Market, by Application, 2017 -2027 (US$ Bn)
TABLE 16 Asia Pacific PIC Market Value, by Region/Country, 2017-2027 (US$ Bn)
TABLE 17 Rest of the World PIC Market, by Product Type, 2017-2027 (US$ Bn)
TABLE 18 Rest of the World PIC Market, by Application, 2017-2027 (US$ Bn)
TABLE 19 Rest of the World PIC Market Value, by Region, 2017-2027 (US$ Bn)
TABLE 20 TE Connectivity: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 21 Amphenol Corporation.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 22 Hirose Electric Co. Ltd.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 23 Fujitsu Component Limited: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 24 Molex, LLC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 25 TTI, Inc.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 26 TT Electronics Plc.: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 27 AVX Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 28 Foxconn Technology Group: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 29 Burndy LLC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 30 Panasonic Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 31 3M: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 32 KYOCERA Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 33 YAGEO Corporation: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)