Passive and Interconnecting Components Market By Component (Passive Components and Interconnecting Components), By Application (Automotive, Aerospace & Defense, Consumer Electronics, Healthcare, Industrial, IT & Telecom, and Others) - Growth, Future Prospects and Competitive Landscape, 2019 – 2027

Overview:                      

The global passive and interconnecting components market was valued at US$ 168.8 Bn in 2018 and is projected to witness noteworthy growth, expanding at a CAGR of 5.1% during the forecast period from 2019 to 2027. Electronic components form an important part of electronic circuitry. These components are used increasingly in several industries including medical electronics, automotive, aerospace & defense, etc. and are of great importance in the telecommunications and consumer electronics sector. Technological advancements have steered multifaceted circuitry that offers high functionality and easy adoption in wide range of applications. Growing trends of highly efficient electronic components and optimization of processes in terms of costs and energy saving have led to the increase in advancements in the electronics sector. As a result, continual innovation and introduction of advanced technologies in the consumer electronics sector is thereby supplementing the growth of the overall passive and interconnecting components market worldwide. 

Market Snapshot 

Passive and Interconnecting Components Market 

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"Interconnecting Components Garnered Largest Market Share in 2018"

In 2018, interconnecting components garnered largest market share in the global passive and interconnecting components market. The segment is likely to grow at a substantial rate during the forecast period from 2019 to 2027. Interconnect is the mechanical and electrical connectivity between two or more terminals that connects the device together. These components mainly comprises of printed circuit boards, connectors, switches, etc. Interconnects are mainly used for connecting every passive component and are responsible for the flow of current between two conductors and electric circuits.  Interconnecting components are of great importance in many modern electronic systems. Growing adoption of interconnects across various end-use industry verticals is expected to enhance the growth of this segment in the coming years.

Passive and Interconnecting Components Market

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"Asia Pacific to Continue its Supremacy during the Forecast Period from 2019 to 2026"

The global passive and interconnecting components market, based on geography was led by Asia Pacific in 2018. The region is expected to continue with its dominance and have an upper hand in the market. The presence of strong semiconductors and electronic companies such as Fujitsu Component Limited, Foxconn Technology Group, Hirose Electric Co., Ltd., etc. are providing diverse business opportunities to the regional passive and interconnecting components market throughout the forecast period from 2019 to 2027.     

Passive and Interconnecting Components Market

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Competitive Insights

The major players identified in the passive and interconnecting components market include TE Connectivity, Amphenol Corporation, Hirose Electric Co., Ltd., Fujitsu  Component Limited, Molex, LLC, TTI, Inc., TT Electronics Plc., AVX Corporation, Foxconn Technology Group (Hon Hai), Burndy LLC, Panasonic Corporation, 3M, KYOCERA Corporation, and YAGEO Corporation among others. These players are incessantly focusing on strengthening their product portfolio in order to cater the rising needs of the customers. New product development, product innovation and partnerships remains some of the major strategies adopted by the leading players to have an edge over their counterparts.

Passive and Interconnecting Components Market

Historical & Forecast Period

The research report presents the analysis of each segment from 2017 to 2027 considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segments calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

Passive and interconnecting components market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of global passive and interconnecting components market based on product type, application, and geography. Key segments covered in the report are as follows: 

ATTRIBUTE DETAILS
Research Period  2017-2027
Base Year 2018
Forecast Period  2019-2027
Historical Year  2017
Unit  USD Billion
Segmentation

 Product Type Segment (2017-2027; US$ Bn)
 • Passive Components
    o Resistors
    o Capacitors
    o Transformers
    o Others (Diodes, Inductors, etc.)
 • Interconnecting Components
    o Printed Circuit Boards
    o Connectors
    o Switches
    o Others (Relays, Fuses, etc.)

 Application Segment (2017 – 2027; US$ Bn)
 • Automotive
 • Aerospace & Defense
 • Consumer Electronics
 • Healthcare
 • Industrial
 • IT & Telecom
 • Others

 Geography Segment (2017-2027; US$ Bn)
 • North America (U.S., Rest of North America)
 • Europe (U.K., Germany, France, Rest of Europe)
 • Asia Pacific (Japan, China, India, Rest of APAC)
 • Rest of the World (Middle East & Africa, Latin America)

Key questions answered in this report

  • What was the market size of passive and interconnecting components market in 2018 and forecast up to 2027?
  • What are the key factors driving the global passive and interconnecting components market?
  • What are the key market trends and high-growth opportunities observed in the passive and interconnecting components market?
  • What are the drivers of the passive and interconnecting components market?
  • Which is the largest regional market for passive and interconnecting components market?
  • Which segment will grow at a faster pace? Why?
  • Which region will drive the market growth? Why?
  • Which players are leading the passive and interconnecting components market?
  • What are the sustainability strategies adopted by the key players operating in the market?
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Published Date:  Jun 2019
Category:  Technology & Media
Report ID:   59724
Report Format:   PDF
Pages:   120
Rating:    4.2 (49)
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