The market for Dual-in-Line Memory Module Sockets Market is expected to reach US$ XX Bn in 2027.
The dual-in-line memory module sockets market worldwide is expected to grow with a CAGR of 15.0% during the forecast period from 2019 to 2027. The integrated circuits market prominently drives the dual-in-line memory module sockets market. A DIMM socket is made using a series of dynamic, random-access memory (RAM) ICs. The modules are attached to a PCB and are primarily designed for servers and PCs. Over the recent years, DIMMs have emerged as the primary memory module, thereby replacing single in-line memory modules (SIMMs). Therefore, we expect the market to grow rapidly throughout the forecast period.
The consumer electronics segment leads the dual-in-line memory module sockets market by application type. With an increase in the popularity of enterprise technologies like big data and cloud-based services, the dependency on servers and expanded memories have increased. Backed by demand from the latest processor platforms for high performance and better system scaling, the dual-in-line memory module sockets market has grown significantly. The consumer electronics segment shall continue to lead the market throughout the forecast period owing to a rise in sales of consumer electronics products such as laptops, PCs, smartphones, smart devices, etc. Hence, the consumer electronics segment is set to dominate the dual-in-line memory module sockets market.
North America led the dual-in-line memory module sockets market. On account of the growing demand for consumer electronics, defense equipment, and automotive in the developed region. On the other hand, Asia Pacific shall be the fastest-growing region throughout the forecast period. Due to immense growth in automotive and consumer electronics, the sale of dual-in-line memory module sockets shall increase. Further, the booming healthcare industry in the region and the growth of medical tourism in countries like India have contributed significantly to the dual-in-line memory module sockets market. Due to the aforementioned factors, Asia Pacific will be the fastest-growing segment throughout the forecast period.
Some of the prominent players operating in the dual-in-line memory module sockets market are Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech, Plastronics, Yamaichi Electronics, TE Connectivity, and Sensata Technologies, among others.
This research report presents the analysis of each segment from 2017 to 2027, considering 2018as the base year for the research. In addition, compounded Annual Growth Rate (CAGR) for each respective segment was calculated for the forecast period from 2019 to 2027.
The dual-in-line memory module sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of the global dual-in-line memory module sockets market based on product type, application, and geography. Key segments covered in the report are as follows:
The market for Dual-in-Line Memory Module Sockets Market is expected to reach US$ XX Bn in 2027.
The Dual-in-Line Memory Module Sockets Market is expected to see significant CAGR growth over the coming years, at 15.0%.
The report is forecasted from 2019-2027.
The base year of this report is 2018.
Enplas, Molex, Aries Electronics, 3M, WinWay are some of the major players in the global market.