Outsourced Semiconductor Assembly and Test (OSAT) Market By Material (Assembly, Testing) By End-Use (Automotive, Telecommunications, Computing & Networking, Consumer Electronics) By Packaging (Ball Grid Array, Chip Scale Package, Multi-Package, Stacked Die, Quad and Dual) - Growth, Future Prospects & Competitive Analysis, 2016 - 2028

About this report

Using crucial parameters, the study on the global market for outsourced semiconductor assembly and test (OSAT) looks into the industry's critical analysis. The benefits for investors are discussed in the paper, along with investment ideas and data on the need for funding in the industry. The report also addresses how obstacles of both economic and non-economic nature are fostering the expansion of the market for outsourced semiconductor assembly and testing (OSAT). The outsourced semiconductor assembly and test (OSAT) industry is affected by these changes on a global scale. The paper also examines market sizes at the international, regional, and national levels, both historically and in the future. The report provides a comprehensive analysis of SRC analysis, demand and supply gaps, competitor positioning, STAR analysis, key investment propositions, and Tornado analysis. Key technological advancements and other analyses include Porter's five forces analysis, value chain analysis, PESTEL analysis, etc.

Key Highlights of the Report

How are the major segments performing in the Outsourced Semiconductor Assembly and Test (OSAT) market?

• In 2021, the assembly segment led the market in terms of service. The global increase in demand for telecommunications infrastructure and consumer electronics is primarily driving growth in market demand for assembly services.
• In 2021, the multi-package packaging segment held the largest global market share owing to its advantages, such as a significant improvement in packaging efficiency due to replacing multiple packages with a single package.
• In 2021, the consumer electronics end-use segment dominated the global market and was expected to continue during the forecast period. The rising global demand for cutting-edge communication devices like smartphones can be attributed to the expansion of this consumer electronics application.

Which region dominated the outsourced semiconductor assembly and test (OSAT) market?

The Asia Pacific region dominated the market in 2021 as a result of several industries, rising demand for consumer electronics like tablets and smartphones as well as increasing demand for automobiles from regional countries like India, Japan, China, and South Korea. The rise in investments made by various businesses to diversify their product offerings is another factor fostering the region's growth. Over the last 20 to 30 years, Asia Pacific's transformation has impacted most outsourced semiconductor manufacturing companies into global production hub over the last 20 to 30 years. The market demand for smartphones is increasing quickly in developing countries like China and India due to growing consumer awareness of cutting-edge technology products and increasing levels of consumer disposable income. These factors are expected to drive growth in the region's OSAT market.

How is the US market performing in the Outsourced Semiconductor Assembly and Test (OSAT) market?

The United States held the major share in the industry. Significant investments, continuous technological advancements, and new application developments fuel the development of the nation's OSAT market. The surge in the development of advanced semiconductor chip applications in the United States is the primary driver of market growth. In addition, new government initiatives in North America, like new legislation in the US initiative to build a USD 7 billion semiconductor industry, are expected to drive the growth of market in the region.

What is the competitive environment of the outsourced semiconductor assembly and test (OSAT) market?

The market appears competitive and fragmented, with many players. Many vendors focus on improving assembly technologies by investing heavily in research and development. Integrated device manufacturers (IDMs) and OSATs are forming joint ventures with new and small vendors or acquiring these vendors to overcome barriers such as market fragmentation and high investments. As a result, small businesses will benefit from higher capacity utilization and a stronger market position. New competitors on the market are also anticipated to benefit from offering OEMs a one-stop solution. For instance, in July 2022, JCET Group declared that it had successfully packaged 4 nm chips for mobile devices and integrated GPU, CPU, and RF chipsets. The XDFOI multi-dimensional advanced packaging technology is a cutting-edge approach to ultra-high-density fan-out packaging. It offers practical solutions with high-density interconnection and increased integration and is highly reliable for the heterogeneous integration of chipsets. Likewise, ASE Group prioritized technological innovation in chips and packaging in June 2022. The business unveiled VIPack, a cutting-edge packaging platform that might make it possible to develop vertically integrated packaging solutions. The VIPack will stand in for ASE's next-generation 3D heterogeneous integration architecture, which broadens design guidelines and offers extremely high effectiveness and density.

Executive Summary

What are the technological developments being developed in the outsourced semiconductor assembly and test (OSAT) market?

Strategic technological collaboration is a key trend in outsourced semiconductor assembly and testing (OSAT). Technology and software firms collaborate with OSAT providers to create new design platforms and technological implementations for next-generation advanced packaging. These collaborations seek to capitalize on each other's expertise and resources to gain a competitive advantage in the market. The complexity of chip-package interaction is rising significantly with the introduction of new technologies like three-dimensional (3D) stacking of integrated circuits and others. For instance, Siemens Digital Industries Software Inc., a US-based business specializing in creating 3D and 2D product lifecycle management tools, expanded its collaboration with Advanced Semiconductor Engineering Inc. (ASE), a Taiwan-based semiconductor assembling and test manufacturing services provider, in February 2021. The partnership has concentrated on creating technologies that support the next generation of high-density, advanced package designs. The expanded partnership will concentrate on creating a single design platform in the future using the Calibre 3DSTACK platform and the Xpedition Substrate Integrator software from Siemens.

Which key investments are being made by the outsourced semiconductor assembly and test (OSAT) market players?

Leading players are expanding their market presence in outsourced semiconductor assembly and testing (OSAT) with long-term investment plans. Leading market players strategically expand their geographic footprint and factory capacity by constructing industry-leading factories across nations. As a result, the global market is experiencing reliable supply chain processes that support customer demands. For instance, Amkor Technology intends to construct a factory in Bac Ninh, Vietnam, in November 2021 that will feature cutting-edge products. The first phase focuses on providing advanced system-in-package (SIP) test and assembly solutions to leading electronic manufacturing and semiconductor firms. Similarly, Northrop Grumman, headquartered in Virginia, United States, awarded Integra Technologies a USD 3.0 million contract in June 2020. The business is making and testing military-grade microelectronics using Integra Technologies' technology to assist its home country's fighting forces.

Some major players in the market are ASE Group (Taiwan), Amkor (US), Walton Advanced Engineering (Taiwan), JCET Group (China), Siliconware Precision Industries Co. Ltd. (Taiwan), KYEC (Taiwan), Signetics (South Korea), Unisem Group (Malaysia), Hana Micron (South Korea), and Powertech Technology Inc. (Taiwan).

What are the major driving factors for the outsourced semiconductor assembly and test (OSAT) market?

Factors such as rising consumer electronics demand and increasing global urbanization primarily drive market expansion. Besides, rising disposable income has boosted sales of consumer electronics such as televisions, mobile phones, and tablets, increasing demand for outsourced semiconductor assembly and testing services. In addition, growing smartphone use significantly fuels market expansion. On the other hand, the expanding chip market will offer OSAT businesses a significant opportunity. Furthermore, the growing shift toward OSAT emerging economies such as China, India, and South Korea is beneficial to market growth.

What are the major risks for the outsourced semiconductor assembly and test (OSAT) market?

The high upfront costs associated with developing, designing, and establishing outsourced semiconductor packaging units to meet the demands of various industries such as IT & telecommunications, automotive, consumer electronics, healthcare, aerospace & defense, and others may restrict the expansion of the outsourced semiconductor assembly and test (OSAT) market. Besides, the lack of technical expertise in outsourced semiconductor packaging is expected to limit the global market's growth.

Which key service is offered in the outsourced semiconductor assembly and test (OSAT) market?

The assembly services segment is expected to grow the fastest due to the increased demand for consumer electronic devices and telecom infrastructure worldwide. Manufacturers can outsource every step of the manufacturing process for semiconductors, from wafer production to testing and assembly, with the help of the assembly service. The service covers every step, including wafer packaging, testing, fabrication, and shipping. This change has occurred owing to manufacturers looking for additional and better ways to reduce operating expenses and hasten the launch of their new product designs. Basic semiconductors are assembled to create finished semiconductors. It facilitates electrical connections, heat dissipation, and fire protection. The assembly segment offers various services, including copper wire bond formation, flip chips, 2.5D and 3D packaging, wafer-level chip-scale packaging (WL-CSP), fan-out wafer-level packaging (FO-WLP), and 2.5D and 3D packaging.

How is the outsourced semiconductor assembly and test (OSAT) market performing in different regions?

In 2021, Asia Pacific held a dominant position in the market. The increase in investments by businesses in expanding their product portfolios is responsible for the region's growth. For instance, Qualcomm Inc., a multinational outsourced semiconductor company headquartered in San Diego, CA, announced in January 2018 the expansion of its facilities in Vietnam as part of a strategy to expand operations into Southeast Asia. Consumer awareness of technologically advanced products and increased disposable income levels drive demand for smartphones in developing markets such as China and India. As a result, companies making electronics, including Foxconn Technology Group, Samsung Electronics Co. Ltd., and others, have established production facilities in these developing nations, which will help the regional OSAT market grow over the forecast period.

The North American market play a significant role in implementing outsourced semiconductor assembly and test (OSAT) services owing to technological advancements. This position can be attributed to the region's large semiconductor vendor base. Another factor driving regional demand for OSAT is the increasing use of multimedia technology devices. Value-added services, like in-house testing and upscale packaging, are provided by several regional OSAT providers, and they will continue to be a key factor in the market's expansion. Several integrated design manufacturers increasingly prioritize outsourced semiconductor assembly and test (OSAT) services as a time-saving alternative.

What is the regulatory landscape for the outsourced semiconductor assembly and test (OSAT) market?

Many key players are collaborating with government agencies to produce industry-leading graduates. The ASE Group strongly emphasizes providing semiconductor assembly and testing facilities at the top of their field and creating programs for graduates that will foster industry growth and advance the economy. For instance, ASE Group and the National Kaohsiung University of Science and Technology (NKUST) collaborated to develop an on-campus talent development facility for semiconductor assembly and testing in October 2020. (SAT). The Ministry of Education (MOE) has taken the initiative to implement semiconductor training in vocational and technical school systems.

What is the market value of the Outsourced Semiconductor Assembly and Test (OSAT) industry?

The market is growing at a substantial CAGR of 6.1% in the upcoming years. The industry is estimated to be worth USD 34.1 billion in 2021 and is expected to be worth USD 48.64 billion by 2028.

What are the major players planning for the future of the outsourced semiconductor assembly and test (OSAT) market?

Top players plan to form partnerships with prominent semiconductor test and handling solution providers to develop next-generation outsourced semiconductor assembly and testing solutions that are also cost-effective. Increasing demand for CMOS (complementary metal oxide semiconductors) and, consequently, OSAT will be driven by various industrial applications, automotive safety, autonomous vehicles, and safety. Semiconductor companies seek application-specific outsourced assembly and testing services, implying that OSAT providers will continue to benefit from significant investment. For instance, Sigurd Microelectronics Corp., an integrated circuit testing and packaging services company based in Taiwan, paid USD 165 million for UTAC Taiwan in January 2021. The acquisition broadens the company's global reach while increasing its annual revenue and production capacity.

Segmentation of Global Outsourced Semiconductor Assembly and Test (OSAT) Market -

Global Outsourced Semiconductor Assembly and Test (OSAT) Market – By Material

• Assembly
• Testing

Global Outsourced Semiconductor Assembly and Test (OSAT) Market – By End-Use

• Automotive
• Telecommunications
• Computing & Networking
• Consumer Electronics
• Others

Global Outsourced Semiconductor Assembly and Test (OSAT) Market – By Packaging

• Ball Grid Array
• Chip Scale Package
• Multi-Package
• Stacked Die
• Quad and Dual

Global Outsourced Semiconductor Assembly and Test (OSAT) Market – By Region

• North America
  • US
  • Canada
• Europe
  • Germany
  • France
  • UK.
  • Italy
  • Spain
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • South-east Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC Countries
  • South Africa
  • Rest of Middle East and Africa

Frequently asked questions about the global outsourced semiconductor assembly and test (OSAT) market