Test And Burn-in Sockets Market

Wide Application to Give Boost to the Test and Burn-in Sockets Market

The test and burn-in sockets market worldwide is expected to grow with a CAGR of 5.6% during the forecast period from 2019 to 2027. The test and burn-in sockets market is driven by the connector market. The test and burn-in sockets denote a small but challenging segment of the connector market. The designs of the sockets are robust and leading edge and are produced in small quantities. The sockets are widely used in smartphones and driving assistance systems. As a result, we expect the market to grow at a rapid pace throughout the forecast period.

Market Synopsis

CMOS Image Sensor Set to Dominate the Market

The test and burn-in sockets market by application type is led by CPU & SPU segment. The sale of test and burn-in sockets has been significant due to the wider adoption of SPU and CPU in high-speed vector processing. Further, the CMOS image sensor market is expected to grow at the fastest pace at a CAGR of 8.7% during the forecast period. In addition, due to the emergence of self-driving cars and advanced driver assistance systems, the demand for CMOS image sensors from the automotive segment has been significant. Hence the CMOS image sensor segment shall continue to lead the test and burn-in sockets market throughout the forecast period.

The Asia Pacific to be the Fastest Growing Region

North America led the test and burn-in sockets market. Growing demand for consumer electronics and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest-growing region. The Asia-Pacific region has been growing ominously. Increased sales of communication equipment, computer, etc., prominently drive the market demand for test and burn-in sockets. Further, an increase in smartphone users and high growth in automotive shall drive the test and burn-in sockets market. As a result of the aforementioned factors, Asia Pacific will be the fastest-growing segment throughout the forecast period.

Some prominent players operating in the test and burn-in sockets market are Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technologies, and Loranger, among others.

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027, considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segment calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

The Test and burn-in sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of the global test and burn-in sockets market based on product type, application, and geography. Key segments covered in the report are as follows:

ATTRIBUTE DETAILS

Research Period   2017-2027

Base Year            2018

Forecast Period    2019-2027

Historical Year      2017

Unit                    USD Million

Segmentation Product Type (2017–2027; US$ Mn)

• Burn-in
• Test

 Application (2017–2027; US$ Mn)

• Memory
• CMOS image sensor
• High Voltage
• RF
• CPU & SPU

 Geography Segment (2017–2027; US$ Mn)

• North America (U.S., Rest of North America)
• Europe (U.K., Germany, France, Rest of Europe)
• Asia Pacific (China, Japan, India, Rest of Asia Pacific)
• Rest of the World (Middle East & Africa, Latin America)

Key questions answered in this report.

• What was the market size of the test and burn-in sockets in 2018, and forecast up to 2027?
• Which is the largest regional market for test and burn-in sockets?
• What major trends followed in overall test and burn-in sockets across different regions?
• Who are the key test and burn-in socket companies leading the market?
• What are the key market strategies adopted by the leading test and burn-in sockets companies?

Unique data points of this report

• Statistics on integrated circuits worldwide
• Recent trends across different regions in terms of the adoption of test and burn-in sockets across various applications
• Notable developments going on in test and burn-in sockets
• Attractive investment proposition for segments as well as geography
• Comparative scenario for all the segments for years 2018 (actual) and 2027 (forecast)

Chapter 1 Preface
1.1 Report Scope and Description
1.1.1 Study Purpose
1.1.2 Target Audience
1.1.3 USP and Key Offerings
1.2 Research Scope
1.3 Research Methodology
1.3.1 Phase I – Secondary Research
1.3.2 Phase II – Primary Research
1.3.3 Approach Adopted
1.3.4 Top-Down Approach
1.3.5 Bottom-Up Approach
1.3.6 Phase III – Expert Panel Review
1.3.7 Assumptions
1.4 Market Segmentation

Chapter 2 Executive Summary
2.1 Market Snapshot: Global TBIS Market
2.1.1 Global TBIS Market, by Product, 2018 (US$ Mn)
2.1.2 Global TBIS Market, by Application, 2018 (US$ Mn)
2.1.3 Global TBIS Market, by Geography, 2018 (US$ Mn)

Chapter 3 Market Dynamics
3.1 Introduction
3.2 Market Dynamics
3.2.1 Market Drivers
3.2.2 Market Restraint
3.3 Attractive Investment Proposition, by Geography, 2018
3.4 Market Positioning of Key TBIS Vendors, 2018

Chapter 4 Global Test and Burn-In Sockets (TBIS) Market, by Product
4.1 Overview
4.1.1 Global TBIS Market Value Share, by Product, 2018 & 2027 (Value, %)
4.2 Burn-In
4.2.1 Global Burn-In Market Value, 2017 – 2027 (US$ Mn)
4.3 Test
4.3.1 Global Test Market Value, 2017 – 2027 (US$ Mn)

Chapter 5 Global Test and Burn-In Sockets (TBIS) Market, by Application
5.1 Overview
5.1.1 Global TBIS Market Value Share, by Application, 2018 & 2027 (Value, %)
5.2 Memory
5.2.1 Global TBIS Market Value from Memory, 2017 – 2027 (US$ Mn)
5.3 CMOS image sensor
5.3.1 Global TBIS Market Value from CMOS image sensor, 2017 – 2027 (US$ Mn)
5.4 High Voltage
5.4.1 Global TBIS Market Value from High Voltage, 2017 – 2027 (US$ Mn)
5.5 RH
5.5.1 Global TBIS Market Value from RH, 2017 – 2027 (US$ Mn)
5.6 CPU
5.6.1 Global TBIS Market Value from CPU, 2017 – 2027 (US$ Mn)

Chapter 6 North America Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
6.1 Overview
6.2 North America TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
6.2.1 Market Analysis
6.3 North America TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
6.3.1 Market Analysis
6.4 North America TBIS Market, by Country, 2017 – 2027 (US$ Mn)
6.4.1 Market Analysis
6.4.2 U.S.
6.4.3 Rest of North America

Chapter 7 Europe Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
7.1 Overview
7.2 Europe TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
7.2.1 Market Analysis
7.3 Europe TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
7.3.1 Market Analysis
7.4 Europe TBIS Market, by Country, 2017 – 2027 (US$ Mn)
7.4.1 Market Analysis
7.4.2 U.K.
7.4.3 Germany
7.4.4 France
7.4.5 Rest of Europe

Chapter 8 Asia Pacific Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
8.1 Overview
8.2 Asia Pacific TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
8.2.1 Market Analysis
8.3 Asia Pacific TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
8.3.1 Market Analysis
8.4 Asia Pacific TBIS Market, by Country, 2017 – 2027 (US$ Mn)
8.4.1 Market Analysis
8.4.2 China
8.4.3 Japan
8.4.4 India
8.4.5 Rest of Asia Pacific

Chapter 9 Rest of the World (RoW) Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
9.1 Overview
9.2 RoW TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
9.2.1 Market Analysis
9.3 RoW TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
9.3.1 Market Analysis
9.4 RoW TBIS Market, by Region (US$ Mn)
9.4.1 Market Analysis
9.4.2 Middle East & Africa (MEA)
9.4.3 Latin America

Chapter 10 Company Profiles
10.1 Yamaichi Electronics
10.2 Cohu
10.3 Enplas
10.4 3M
10.5 ISC
10.6 Smiths Interconnect
10.7 LEENO
10.8 Sensata Technologies
10.9 Johnstech
10.10 Yokowo
10.11 WinWay Technologies
10.12 Loranger

List of Figures

FIG. 1 Global Test and Burn-In Sockets (TBIS) Market: Research Methodology
FIG. 2 Market Size Estimation – Top Down & Bottom up Approach
FIG. 3 Global TBIS Market Segmentation
FIG. 4 Global TBIS Market, by Product, 2018 (US$ Mn)
FIG. 5 Global TBIS Market, by Application, 2018 (US$ Mn)
FIG. 6 Global TBIS Market, by Geography, 2018 (US$ Mn)
FIG. 7 Attractive Investment Proposition, by Geography, 2018
FIG. 8 Market Positioning of Key TBIS Vendors, 2018
FIG. 9 Global TBIS Market Value Share, by Product, 2018 & 2027 (Value, %)
FIG. 10 Global Burn-In Market Value, 2017 – 2027 (US$ Mn)
FIG. 11 Global Test Market Value, 2017 – 2027 (US$ Mn)
FIG. 12 Global TBIS Market Value Share, by Application, 2018 & 2027 (Value, %)
FIG. 13 Global TBIS Market Value from Memory, 2017 – 2027 (US$ Mn)
FIG. 14 Global TBIS Market Value from CMOS image sensor, 2017 – 2027 (US$ Mn)
FIG. 15 Global TBIS Market Value from High Voltage, 2017 – 2027 (US$ Mn)
FIG. 16 Global TBIS Market Value from RH, 2017 – 2027 (US$ Mn)
FIG. 17 Global TBIS Market Value from CPU, 2017 – 2027 (US$ Mn)

List of Tables

TABLE 1 Market Snapshot: Global Test and Burn-In Sockets (TBIS) Market Value
TABLE 2 North America TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 3 North America TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 4 North America TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 5 Europe TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 6 Europe TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 7 Europe TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 8 Asia Pacific TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 9 Asia Pacific TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 10 Asia Pacific TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 11 RoW TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 12 RoW TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 13 RoW TBIS Market Value, by Region, 2017 – 2027 (US$ Mn)
TABLE 14 Yamaichi Electronics: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 15 Cohu: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 16 Enplas: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 17 3M: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 18 ISC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 19 Smiths Interconnect: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 20 LEENO: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 21 Sensata Technologies: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 22 Johnstech: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 23 Yokowo: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 24 WinWay Technologies: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 25 Loranger: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)