The market for Test And Burn-in Sockets Market is expected to reach US$ XX Bn in 2027.
The test and burn-in sockets market worldwide is expected to grow with a CAGR of 5.6% during the forecast period from 2019 to 2027. The test and burn-in sockets market is driven by the connector market. The test and burn-in sockets denote a small but challenging segment of the connector market. The designs of the sockets are robust and leading edge and are produced in small quantities. The sockets are widely used in smartphones and driving assistance systems. As a result, we expect the market to grow at a rapid pace throughout the forecast period.
The test and burn-in sockets market by application type is led by CPU & SPU segment. The sale of test and burn-in sockets has been significant due to the wider adoption of SPU and CPU in high-speed vector processing. Further, the CMOS image sensor market is expected to grow at the fastest pace at a CAGR of 8.7% during the forecast period. In addition, due to the emergence of self-driving cars and advanced driver assistance systems, the demand for CMOS image sensors from the automotive segment has been significant. Hence the CMOS image sensor segment shall continue to lead the test and burn-in sockets market throughout the forecast period.
North America led the test and burn-in sockets market. Growing demand for consumer electronics and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest-growing region. The Asia-Pacific region has been growing ominously. Increased sales of communication equipment, computer, etc., prominently drive the market demand for test and burn-in sockets. Further, an increase in smartphone users and high growth in automotive shall drive the test and burn-in sockets market. As a result of the aforementioned factors, Asia Pacific will be the fastest-growing segment throughout the forecast period.
Some prominent players operating in the test and burn-in sockets market are Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technologies, and Loranger, among others.
This research report presents the analysis of each segment from 2017 to 2027, considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segment calculated for the forecast period from 2019 to 2027.
The Test and burn-in sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of the global test and burn-in sockets market based on product type, application, and geography. Key segments covered in the report are as follows:
Research Period 2017-2027
Base Year 2018
Forecast Period 2019-2027
Historical Year 2017
Unit USD Million
The market for Test And Burn-in Sockets Market is expected to reach US$ XX Bn in 2027.
The Test And Burn-in Sockets Market is expected to see significant CAGR growth over the coming years, at 5.6%.
The report is forecasted from 2019-2027.
The base year of this report is 2018.
Yamaichi Electronics, Cohu, Enplas, 3M, ISC, Smiths Interconnect are some of the major players in the global market.