Test And Burn-in Sockets Market By Product (Burn-In, Test), By Application (Memory, CMOS Image Sensor, High Voltage, RH, CPU) - Growth, Future Prospects And Competitive Analysis 2019 - 2027

Wide Application to Give Boost to the Test and Burn-in Sockets Market

The test and burn-in sockets market worldwide is expected to grow with a CAGR of 5.6% during the forecast period from 2019 to 2027. The test and burn-in sockets market is driven by the connector market. The test and burn-in sockets denote a small but challenging segment of the connector market. The designs of the sockets are robust, leading edge and are produced in small quantities. The sockets are widely used in smartphones and driving assistance systems. As a result, we expect the market to grow with a rapid pace throughout the forecast period.

Market Synopsis

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CMOS Image Sensor Set to Dominate the Market

The test and burn-in sockets market by application type is led by CPU & SPU segment. Owing to wider adoption of SPU and CPU in high speed vector processing, the sale of test and burn-in socket has been significant. Further, the CMOS image sensor market is expected to grow at the fastest pace at a CAGR of 8.7% during the forecast period. Due to emergence of self-driving cars and advanced driver assistance systems, the demand for CMOS image sensors from the automotive segment has been significant. Hence the CMOS image sensor segment shall continue to lead the test and burn-in sockets market throughout the forecast period.

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Asia Pacific to be the Fastest Growing Region

North America led the test and burn-in sockets market. Growing demand for consumer electronics, and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest growing region. Asia-Pacific region has been growing ominously. Increased sale of communication equipment, computer, etc. prominently drive the demand for test and burn-in sockets market. Further, increase in number of smart phone users and high growth in automotive shall drive the test and burn-in sockets market. As a result of aforementioned factors, Asia Pacific will be the fastest growing segment throughout the forecast period.

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Some of the prominent players operating in the test and burn-in sockets market  Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technologies, Loranger among others.

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027 considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segments calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

The Test and burn-in sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of global test and burn-in sockets market based on product type, application and geography. Key segments covered in the report are as follows:

Key questions answered in this report

• What was the market size of test and burn-in sockets in 2018 and forecast up to 2027?
• Which is the largest regional market for test and burn-in sockets?
• What are the major trends followed in overall test and burn-in sockets across different regions?
• Who are the key test and burn-in sockets companies leading the market?
• What are the key strategies adopted by the leading test and burn-in sockets companies in market?

Unique data points of this report

• Statistics on integrated circuits worldwide
• Recent trends across different regions in terms of adoption of test and burn-in sockets across various applications
• Notable developments going on in test and burn-in sockets
• Attractive investment proposition for segments as well as geography
• Comparative scenario for all the segments for years 2018 (actual) and 2027 (forecast)

Chapter 1 Preface
1.1 Report Scope and Description
1.1.1 Study Purpose
1.1.2 Target Audience
1.1.3 USP and Key Offerings
1.2 Research Scope
1.3 Research Methodology
1.3.1 Phase I – Secondary Research
1.3.2 Phase II – Primary Research
1.3.3 Approach Adopted
1.3.4 Top-Down Approach
1.3.5 Bottom-Up Approach
1.3.6 Phase III – Expert Panel Review
1.3.7 Assumptions
1.4 Market Segmentation

Chapter 2 Executive Summary
2.1 Market Snapshot: Global TBIS Market
2.1.1 Global TBIS Market, by Product, 2018 (US$ Mn)
2.1.2 Global TBIS Market, by Application, 2018 (US$ Mn)
2.1.3 Global TBIS Market, by Geography, 2018 (US$ Mn)

Chapter 3 Market Dynamics
3.1 Introduction
3.2 Market Dynamics
3.2.1 Market Drivers
3.2.2 Market Restraint
3.3 Attractive Investment Proposition, by Geography, 2018
3.4 Market Positioning of Key TBIS Vendors, 2018

Chapter 4 Global Test and Burn-In Sockets (TBIS) Market, by Product
4.1 Overview
4.1.1 Global TBIS Market Value Share, by Product, 2018 & 2027 (Value, %)
4.2 Burn-In
4.2.1 Global Burn-In Market Value, 2017 – 2027 (US$ Mn)
4.3 Test
4.3.1 Global Test Market Value, 2017 – 2027 (US$ Mn)

Chapter 5 Global Test and Burn-In Sockets (TBIS) Market, by Application
5.1 Overview
5.1.1 Global TBIS Market Value Share, by Application, 2018 & 2027 (Value, %)
5.2 Memory
5.2.1 Global TBIS Market Value from Memory, 2017 – 2027 (US$ Mn)
5.3 CMOS image sensor
5.3.1 Global TBIS Market Value from CMOS image sensor, 2017 – 2027 (US$ Mn)
5.4 High Voltage
5.4.1 Global TBIS Market Value from High Voltage, 2017 – 2027 (US$ Mn)
5.5 RH
5.5.1 Global TBIS Market Value from RH, 2017 – 2027 (US$ Mn)
5.6 CPU
5.6.1 Global TBIS Market Value from CPU, 2017 – 2027 (US$ Mn)

Chapter 6 North America Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
6.1 Overview
6.2 North America TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
6.2.1 Market Analysis
6.3 North America TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
6.3.1 Market Analysis
6.4 North America TBIS Market, by Country, 2017 – 2027 (US$ Mn)
6.4.1 Market Analysis
6.4.2 U.S.
6.4.3 Rest of North America

Chapter 7 Europe Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
7.1 Overview
7.2 Europe TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
7.2.1 Market Analysis
7.3 Europe TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
7.3.1 Market Analysis
7.4 Europe TBIS Market, by Country, 2017 – 2027 (US$ Mn)
7.4.1 Market Analysis
7.4.2 U.K.
7.4.3 Germany
7.4.4 France
7.4.5 Rest of Europe

Chapter 8 Asia Pacific Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
8.1 Overview
8.2 Asia Pacific TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
8.2.1 Market Analysis
8.3 Asia Pacific TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
8.3.1 Market Analysis
8.4 Asia Pacific TBIS Market, by Country, 2017 – 2027 (US$ Mn)
8.4.1 Market Analysis
8.4.2 China
8.4.3 Japan
8.4.4 India
8.4.5 Rest of Asia Pacific

Chapter 9 Rest of the World (RoW) Test and Burn-In Sockets (TBIS) Market Analysis, 2017 – 2027 (US$ Mn)
9.1 Overview
9.2 RoW TBIS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
9.2.1 Market Analysis
9.3 RoW TBIS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
9.3.1 Market Analysis
9.4 RoW TBIS Market, by Region (US$ Mn)
9.4.1 Market Analysis
9.4.2 Middle East & Africa (MEA)
9.4.3 Latin America

Chapter 10 Company Profiles
10.1 Yamaichi Electronics
10.2 Cohu
10.3 Enplas
10.4 3M
10.5 ISC
10.6 Smiths Interconnect
10.7 LEENO
10.8 Sensata Technologies
10.9 Johnstech
10.10 Yokowo
10.11 WinWay Technologies
10.12 Loranger

* Here we are using TBIS as a short form of Test and Burn-In Sockets

FIG. 1 Global Test and Burn-In Sockets (TBIS) Market: Research Methodology
FIG. 2 Market Size Estimation – Top Down & Bottom up Approach
FIG. 3 Global TBIS Market Segmentation
FIG. 4 Global TBIS Market, by Product, 2018 (US$ Mn)
FIG. 5 Global TBIS Market, by Application, 2018 (US$ Mn)
FIG. 6 Global TBIS Market, by Geography, 2018 (US$ Mn)
FIG. 7 Attractive Investment Proposition, by Geography, 2018
FIG. 8 Market Positioning of Key TBIS Vendors, 2018
FIG. 9 Global TBIS Market Value Share, by Product, 2018 & 2027 (Value, %)
FIG. 10 Global Burn-In Market Value, 2017 – 2027 (US$ Mn)
FIG. 11 Global Test Market Value, 2017 – 2027 (US$ Mn)
FIG. 12 Global TBIS Market Value Share, by Application, 2018 & 2027 (Value, %)
FIG. 13 Global TBIS Market Value from Memory, 2017 – 2027 (US$ Mn)
FIG. 14 Global TBIS Market Value from CMOS image sensor, 2017 – 2027 (US$ Mn)
FIG. 15 Global TBIS Market Value from High Voltage, 2017 – 2027 (US$ Mn)
FIG. 16 Global TBIS Market Value from RH, 2017 – 2027 (US$ Mn)
FIG. 17 Global TBIS Market Value from CPU, 2017 – 2027 (US$ Mn)

TABLE 1 Market Snapshot: Global Test and Burn-In Sockets (TBIS) Market Value
TABLE 2 North America TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 3 North America TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 4 North America TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 5 Europe TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 6 Europe TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 7 Europe TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 8 Asia Pacific TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 9 Asia Pacific TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 10 Asia Pacific TBIS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 11 RoW TBIS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 12 RoW TBIS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 13 RoW TBIS Market Value, by Region, 2017 – 2027 (US$ Mn)
TABLE 14 Yamaichi Electronics: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 15 Cohu: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 16 Enplas: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 17 3M: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 18 ISC: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 19 Smiths Interconnect: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 20 LEENO: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 21 Sensata Technologies: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 22 Johnstech: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 23 Yokowo: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 24 WinWay Technologies: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 25 Loranger: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)