ASIC Design IP Core Market By Product Type (Processor IP Cores, Interface IP Cores, Memory IP Cores, Analog/Mixed-Signal IP Cores, Standard Cell-Based ASICs, Others); By Application (Telecommunications, Automotive, Consumer Electronics, Industrial Automation, Healthcare and Medical Devices, Others) – Growth, Share, Opportunities & Competitive Analysis, 2024 – 2032
The ASIC Design IP Core Market size was valued at USD 4,114.35 million in 2018 to USD 6,449.01 million in 2024 and is anticipated to reach USD 11,793.41 million by 2032, at a CAGR of 7.30% during the forecast period.
The ASIC Design IP Core market is driven by the rising demand for customized and power-efficient semiconductor solutions across sectors such as automotive, consumer electronics, telecommunications, and industrial automation. Increasing adoption of advanced technologies like AI, IoT, and 5G is compelling OEMs to integrate highly optimized IP cores that support faster processing, lower latency, and enhanced functionality. The growing need for SoC (System-on-Chip) designs is accelerating the use of pre-verified IP cores to reduce time-to-market and development costs. Market players are increasingly focusing on low-power and security-focused IP solutions to meet evolving application requirements, particularly in edge computing and autonomous systems. Trends shaping the market include the transition toward 3nm and 5nm process nodes, growing collaboration between foundries and IP vendors, and the expansion of RISC-V-based cores for open architecture flexibility. The surge in chiplet-based designs and modular IP reuse strategies also supports scalability and accelerates innovation in high-performance computing environments.
The ASIC Design IP Core Market spans North America, Europe, Asia Pacific, Latin America, the Middle East, and Africa. North America leads in revenue, driven by strong demand across telecom, automotive, and consumer electronics sectors. Europe follows, supported by advancements in industrial automation and EV technologies. Asia Pacific is the fastest-growing region, fueled by large-scale semiconductor manufacturing in China, Japan, South Korea, and India. Latin America shows steady growth in telecom and electronics manufacturing, while the Middle East sees rising investments in defense and smart infrastructure. Africa remains in the early stages of adoption, with growing interest in localized chip design. Key players in the market include Arm Holdings, Synopsys Inc., Cadence Design Systems, Broadcom Inc., Intel Corporation, Qualcomm, CEVA Inc., Analog Devices, Texas Instruments, ON Semiconductor, Maxim Integrated Products, and Imagination Technologies. These companies compete on IP portfolio strength, design efficiency, and advanced technology integration.
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The ASIC Design IP Core Market was valued at USD 4,114.35 million in 2018, reached USD 6,449.01 million in 2024, and is projected to hit USD 11,793.41 million by 2032, growing at a CAGR of 7.30%.
Demand for custom SoC designs across automotive, consumer electronics, and industrial sectors is driving IP core integration to enhance performance, reduce power use, and shorten development cycles.
AI, IoT, and 5G adoption is pushing demand for application-specific IP cores that support edge computing, neural processing, and high-speed connectivity.
Pre-verified and reusable IP blocks help reduce time-to-market and development costs, allowing semiconductor firms to focus on value-added functionality.
Asia Pacific leads in growth, while North America holds the largest market share; Europe, Latin America, Middle East, and Africa contribute with sector-specific growth patterns.
Design complexity and IP integration challenges persist, especially with heterogeneous architectures and multiple third-party core alignment.
Key players include Arm Holdings, Synopsys, Cadence Design Systems, Broadcom, Intel, Qualcomm, CEVA, Analog Devices, Texas Instruments, ON Semiconductor, Maxim Integrated, and Imagination Technologies.
Market Drivers
Rising Demand for Custom SoC Designs Across Industries
The ASIC Design IP Core Market is expanding due to the increasing adoption of custom System-on-Chip (SoC) designs across automotive, consumer electronics, and industrial sectors. OEMs require tailored solutions that deliver high performance, reduced power consumption, and compact form factors. These requirements drive the integration of pre-verified IP cores, enabling faster product development. It supports innovation in AI-enabled devices, infotainment systems, and industrial automation. The shift toward application-specific designs fuels continuous IP customization.
For instnace, in consumer electronics, MediaTek supplies custom SoCs for a wide range of devices, including smartphones, smart TVs, and IoT products, supporting the growing demand for region-specific and high-performance chips.
Proliferation of AI, IoT, and 5G Applications
The integration of AI, IoT, and 5G technologies is reshaping chip design requirements, creating new growth opportunities in the ASIC Design IP Core Market. Devices must process large data volumes efficiently, with minimal latency and power consumption. IP cores optimized for neural processing, edge computing, and high-speed connectivity are now essential. It drives demand for scalable, application-specific architectures. Vendors are developing specialized cores to meet emerging data-centric performance standards.
For instance, Google’s Edge TPU, designed for edge AI and IoT devices, achieves 4 trillion operations per second at just 2 W of power, powering real-time machine learning in smart cameras and industrial sensors.
Growing Need to Reduce Time-to-Market and Development Cost
Accelerating innovation cycles are pressuring semiconductor firms to deliver solutions faster and more cost-effectively. The ASIC Design IP Core Market addresses this challenge by offering reusable and validated IP blocks, which reduce development risk and shorten design timelines. It enables companies to focus internal resources on differentiation rather than foundational circuitry. IP core licensing improves scalability and supports rapid prototyping. The model aligns with the increasing complexity of modern chip architectures.
Advancements in Semiconductor Process Technologies
Continual progress in process nodes—shifting toward 5nm, 3nm, and even below—requires IP cores that can function reliably at lower geometries. The ASIC Design IP Core Market is evolving to support these advancements with cores tailored for high-speed, low-power operation. It enables manufacturers to meet rising performance demands in HPC, autonomous vehicles, and smart devices. Close collaboration between foundries, EDA tool providers, and IP vendors ensures compatibility with cutting-edge silicon processes.
Market Trends
Expansion of RISC-V and Open-Source IP Adoption
The ASIC Design IP Core Market is witnessing increased adoption of open-source instruction set architectures, particularly RISC-V. Enterprises seek greater design flexibility and freedom from licensing constraints traditionally associated with proprietary cores. It allows developers to customize their architecture without vendor lock-in. RISC-V-based IP cores are gaining traction in embedded, consumer, and industrial applications. Startups and established firms are investing in open-source IP to drive innovation and reduce long-term costs in chip development cycles.
For instance, Syntacore offers configurable RISC-V processor IPs, from compact 32-bit MCU cores for deeply embedded IoT and industrial uses to high-performance 64-bit multicore clusters supporting Linux and AI workloads.
Growth in Chiplet and Modular IP Architectures
The transition toward chiplet-based designs is transforming IP core strategies. In the ASIC Design IP Core Market, companies are decomposing large monolithic SoCs into smaller, interoperable chiplets that can be developed and reused independently. It supports scalability, simplifies debugging, and enhances design flexibility. Modular IP approaches allow manufacturers to mix and match functional blocks depending on use cases. This trend accelerates system integration and boosts customization across AI, HPC, and communications markets.
For instance, AMD’s EPYC processors use chiplet technology, integrating multiple CPU chiplets and an I/O die on a single package, which allows for higher core counts and flexible scaling depending on application needs.
Focus on Security-Driven and Low-Power IP Core Design
Increasing concerns around data security and energy efficiency are driving demand for secure and low-power IP cores. The ASIC Design IP Core Market is evolving to address threats across both consumer and enterprise devices. It supports the integration of encryption engines, tamper-resistant logic, and real-time anomaly detection at the hardware level. Power-optimized IP blocks are also vital in battery-powered IoT and edge devices. Vendors are embedding these features into core libraries to enhance system resilience and sustainability.
Integration of AI and ML Accelerators within IP Cores
The rising implementation of artificial intelligence in end-user devices is fueling demand for AI-ready IP cores. The ASIC Design IP Core Market is adapting by embedding machine learning accelerators, neural network engines, and DSP enhancements directly within core architectures. It enables localized data processing, reducing dependence on cloud infrastructure and improving latency. Vendors are optimizing these IPs for computer vision, speech recognition, and predictive analytics across industrial, automotive, and consumer applications.
Market Challenges Analysis
High Design Complexity and Integration Barriers
The ASIC Design IP Core Market faces challenges related to increasing design complexity and multi-core integration. Advanced nodes and heterogeneous architectures demand meticulous planning, validation, and compatibility across IP blocks. It requires significant engineering expertise and rigorous verification to avoid costly silicon failures. Aligning third-party IP with proprietary designs often leads to compatibility issues and delays. These integration hurdles can extend development timelines and increase project costs for semiconductor firms.
Intellectual Property Licensing and Compliance Risks
Navigating IP licensing frameworks remains a critical challenge in the ASIC Design IP Core Market. Developers must manage a mix of proprietary and open-source components, each governed by different legal terms and restrictions. It introduces risk of non-compliance and potential litigation, especially when integrating cores from multiple vendors. Ensuring transparency, version control, and documentation becomes essential. Mismanagement in this area can disrupt product launch schedules and compromise long-term maintainability.
Market Opportunities
Rising Demand from Edge AI and IoT Applications
The ASIC Design IP Core Market presents strong opportunities driven by the proliferation of edge AI and IoT devices. These applications require compact, energy-efficient, and application-specific chips that perform real-time processing without relying on cloud infrastructure. It creates demand for lightweight, customizable IP cores tailored for low-power and latency-sensitive environments. Companies developing smart sensors, wearables, and edge analytics platforms seek IP that balances performance with minimal footprint. This segment is expected to fuel long-term growth.
Expansion in Automotive and Aerospace Sectors
The growing complexity of automotive electronics and aerospace systems offers significant potential for the ASIC Design IP Core Market. Demand for functional safety, real-time processing, and secure communication drives the need for specialized IP cores. It supports development of autonomous driving, ADAS, and mission-critical avionics systems. Regulatory mandates around safety and cyber-resilience also encourage OEMs to adopt pre-verified, standards-compliant cores. This trend opens new revenue streams for vendors offering domain-specific IP portfolios.
Market Segmentation Analysis:
By Product Type
The ASIC Design IP Core Market is segmented by product type into Processor IP Cores, Interface IP Cores, Memory IP Cores, Analog/Mixed-Signal IP Cores, Standard Cell-Based ASICs, and Others. Processor IP cores hold a dominant share due to their critical role in SoC designs for handling computing tasks in AI, mobile, and automotive applications. Interface IP cores are gaining traction with increasing demand for connectivity standards like USB, PCIe, and HDMI. Memory IP cores support faster data access and storage in high-speed systems. Analog/Mixed-Signal IP cores are essential in sensor interfaces and signal processing. Standard cell-based ASICs remain relevant in customized logic implementation across embedded systems. The Others segment includes specialized IP blocks addressing niche and emerging application needs.
For instance, Cadence’s Tensilica Vision P5 DSP core is used in imaging and computer vision applications, offering up to 1.1 GHz clock speed on 16 nm technology and supporting 256 peak ALU operations per cycle, which enables efficient AI and video processing in advanced SoCs.
By Application
By application, the ASIC Design IP Core Market includes Telecommunications, Automotive, Consumer Electronics, Industrial Automation, Healthcare and Medical Devices, and Others. Telecommunications leads the segment due to rising deployment of 5G infrastructure, which demands high-speed, low-latency chip designs. Automotive follows with rapid growth in ADAS and EV technologies requiring secure, real-time processing. Consumer electronics maintain strong adoption, driven by demand for high-performance, energy-efficient devices. Industrial automation benefits from IP integration in robotics, control systems, and smart sensors. Healthcare and medical devices use ASIC IP for precision diagnostics and wearable devices. The Others segment captures defense, aerospace, and emerging AI-based applications.
For instance, Ericsson integrates custom ASICs in its 5G baseband units to optimize digital front-end functions like beamforming and digital up/down conversion, enhancing performance and reducing power consumption in large-scale 5G rollouts.
Segments:
Based on Product Type:
Processor IP Cores
Interface IP Cores
Memory IP Cores
Analog/Mixed-Signal IP Cores
Standard Cell-Based ASICs
Others
Based on Application:
Telecommunications
Automotive
Consumer Electronics
Industrial Automation
Healthcare and Medical Devices
Others
Based on Region:
North America
Europe
Asia Pacific
Latin America
Middle East
Africa
Regional Analysis
North America
The North America ASIC Design IP Core Market size was valued at USD 1,181.31 million in 2018, reached USD 1,822.39 million in 2024, and is anticipated to reach USD 3,346.79 million by 2032, at a CAGR of 7.4% during the forecast period. North America accounts for the largest revenue share in the global ASIC Design IP Core Market. It benefits from the strong presence of leading semiconductor companies and robust demand across consumer electronics, telecommunications, and automotive sectors. High investments in AI, 5G infrastructure, and autonomous vehicles continue to drive IP adoption. The U.S. leads regional growth, supported by advanced design tools, mature foundry ecosystems, and government-backed R&D initiatives. Canada and Mexico contribute to industrial and automotive IP demand.
Europe
The Europe ASIC Design IP Core Market size was valued at USD 807.81 million in 2018, reached USD 1,200.24 million in 2024, and is anticipated to reach USD 2,006.21 million by 2032, at a CAGR of 6.1% during the forecast period. Europe holds a significant share of the ASIC Design IP Core Market, driven by the region’s focus on automotive innovation, industrial automation, and regulatory-compliant semiconductor design. Germany, France, and the UK lead IP adoption in EVs, ADAS, and energy-efficient electronics. Demand for IP cores is rising across factory automation and smart grid systems. Europe’s emphasis on data protection and hardware-level cybersecurity enhances the need for secure IP integration. Regional initiatives support chip design self-sufficiency and supply chain resilience.
Asia Pacific
The Asia Pacific ASIC Design IP Core Market size was valued at USD 1,750.00 million in 2018, reached USD 2,847.08 million in 2024, and is anticipated to reach USD 5,532.46 million by 2032, at a CAGR of 8.1% during the forecast period. Asia Pacific leads in growth rate and stands as a critical production and consumption hub in the global ASIC Design IP Core Market. China, Japan, South Korea, and Taiwan drive demand through large-scale semiconductor manufacturing and increasing domestic innovation. It benefits from the rapid expansion of IoT, mobile devices, and AI edge computing. Regional governments invest heavily in chip design capabilities to reduce foreign dependence. Startups and foundries in the region adopt advanced IP for faster time-to-market and scalability.
Latin America
The Latin America ASIC Design IP Core Market size was valued at USD 197.99 million in 2018, reached USD 306.56 million in 2024, and is anticipated to reach USD 497.40 million by 2032, at a CAGR of 5.7% during the forecast period. Latin America shows steady adoption of ASIC IP cores across telecom, automotive, and industrial applications. Brazil leads the region in demand, driven by the modernization of telecom infrastructure and increasing vehicle electronics. Mexico supports growth with its expanding electronics manufacturing ecosystem. It benefits from international partnerships and IP licensing agreements. Regional challenges such as limited R&D funding persist, but digital transformation initiatives continue to boost IP demand.
Middle East
The Middle East ASIC Design IP Core Market size was valued at USD 107.92 million in 2018, reached USD 153.64 million in 2024, and is anticipated to reach USD 233.79 million by 2032, at a CAGR of 4.8% during the forecast period. The Middle East market is gradually adopting ASIC IP cores across telecom, defense, and smart infrastructure projects. GCC countries are investing in localized chip design to support digital economy goals and smart city rollouts. Israel contributes with its strong base of fabless semiconductor firms and defense-focused IP integration. It also benefits from government-led innovation initiatives and research hubs. Challenges include limited fabrication infrastructure and reliance on external IP vendors.
Africa
The Africa ASIC Design IP Core Market size was valued at USD 69.31 million in 2018, reached USD 119.10 million in 2024, and is anticipated to reach USD 176.76 million by 2032, at a CAGR of 4.5% during the forecast period. Africa represents an emerging market with growing interest in semiconductor technologies. South Africa leads regional development, focusing on localized electronics production and digital innovation. It sees gradual IP adoption in healthcare devices, mobile connectivity, and industrial automation. Limited technical expertise and infrastructure constrain faster growth. However, international collaborations and skills development programs continue to expand the regional IP design ecosystem. The market remains in its early stages but shows long-term potential.
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The ASIC Design IP Core Market features strong competition driven by innovation, IP portfolio breadth, and integration capabilities. Leading players such as Arm Holdings, Synopsys Inc., and Cadence Design Systems dominate through extensive libraries, strategic partnerships, and deep-rooted customer relationships. The market sees active participation from firms like Broadcom Inc., Qualcomm, and Intel Corporation, which focus on high-performance and domain-specific IP cores. It demands continuous investment in advanced node support, security features, and power efficiency. Companies like CEVA Inc., Analog Devices, and ON Semiconductor enhance their offerings through specialized IP for wireless, signal processing, and analog-mixed signal domains. Texas Instruments, Maxim Integrated Products, and Imagination Technologies compete by delivering customizable, application-driven solutions. The ASIC Design IP Core Market favors vendors that enable fast time-to-market, seamless integration, and scalability across verticals such as automotive, telecom, and consumer electronics. Competitive positioning hinges on ecosystem alignment, IP reuse models, and long-term support services.
Recent Developments
In July 2025, GlobalFoundries acquired MIPS to enhance its RISC‑V compute IP capabilities, becoming the first pure-play foundry to offer RISC‑V-based processor cores.
In March 2025, Cadence joined the Intel Foundry Accelerator Design Services Alliance to provide advanced ASIC design and IP solutions for AI and HPC applications.
In April 2025, KeyASIC partnered with AnySilicon to expand its global presence and promote its ASIC services and IP cores through enhanced lead generation.
In March 2025, CAST launched the first commercial SNOW-V Stream Cipher IP Core, targeting high-speed, low-latency security for 5G, 6G, and future mobile networks, and supporting both ASICs and FPGAs.
In February 2025, Siemens announced a partnership with Alphawave Semi to accelerate customer time-to-market with advanced silicon IP solutions.
Market Concentration & Characteristics
The ASIC Design IP Core Market exhibits a moderate to high level of market concentration, with a few dominant players such as Arm Holdings, Synopsys Inc., and Cadence Design Systems holding significant shares due to their extensive IP portfolios and global partnerships. It is characterized by high entry barriers, driven by the need for advanced design expertise, proven silicon validation, and long-term client support. Vendors compete on the basis of power efficiency, scalability, compatibility with advanced process nodes, and security integration. The market favors firms that offer differentiated, application-specific IP cores and support rapid system integration. It shows strong alignment with trends in AI, edge computing, and 5G, which demand specialized, low-latency architectures. Licensing models, ecosystem support, and compliance with evolving industry standards play a central role in vendor selection. The ASIC Design IP Core Market continues to evolve with increased adoption of RISC-V architectures, modular chiplet designs, and collaborative foundry engagements.
Report Coverage
The research report offers an in-depth analysis based on Product Type,Application and Region. It details leading market players, providing an overview of their business, product offerings, investments, revenue streams, and key applications. Additionally, the report includes insights into the competitive environment, SWOT analysis, current market trends, as well as the primary drivers and constraints. Furthermore, it discusses various factors that have driven market expansion in recent years. The report also explores market dynamics, regulatory scenarios, and technological advancements that are shaping the industry. It assesses the impact of external factors and global economic changes on market growth. Lastly, it provides strategic recommendations for new entrants and established companies to navigate the complexities of the market.
Future Outlook
Demand for application-specific IP cores will grow across automotive, telecom, and consumer electronics industries.
Integration of AI and machine learning accelerators into IP cores will drive design innovation.
Adoption of RISC-V architecture will increase due to its open-source flexibility and cost advantages.
Chiplet-based designs will support modular IP integration and scalable SoC development.
Edge computing growth will require low-power, latency-optimized IP cores for real-time processing.
IP vendors will expand collaboration with foundries to support advanced nodes like 3nm and below.
Security-focused IP solutions will gain traction across sectors handling sensitive data.
IP reuse strategies will become essential to reduce design time and manage complexity.
Emerging markets will adopt IP cores to localize semiconductor design and manufacturing.
Vendors will invest in ecosystem development to offer end-to-end design and verification support.
10.1. ASIC Design IP Core Market Overview by Region Segment
10.1.1. Global ASIC Design IP Core Market Revenue Share By Region
10.1.2. Regions
10.1.3. Product Type
10.1.4. Global ASIC Design IP Core Market Revenue By Product Type
10.1.5. Application
10.1.6. Global ASIC Design IP Core Market Revenue By Application
CHAPTER NO. 11: NORTH AMERICA ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
11.1. North America ASIC Design IP Core Market Overview by Country Segment
11.1.1. North America ASIC Design IP Core Market Revenue Share By Region
11.2. North America
11.2.1. North America ASIC Design IP Core Market Revenue By Country
11.2.2. Product Type
11.2.3. North America ASIC Design IP Core Market Revenue By Product Type
11.2.4. Application
11.2.5. North America ASIC Design IP Core Market Revenue By Application
11.3. U.S.
11.4. Canada
11.5. Mexico
CHAPTER NO. 12: EUROPE ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
12.1. Europe ASIC Design IP Core Market Overview by Country Segment
12.1.1. Europe ASIC Design IP Core Market Revenue Share By Region
12.2. Europe
12.2.1. Europe ASIC Design IP Core Market Revenue By Country
12.2.2. Product Type
12.2.3. Europe ASIC Design IP Core Market Revenue By Product Type
12.2.4. Application
12.2.5. Europe ASIC Design IP Core Market Revenue By Application
12.3. UK
12.4. France
12.5. Germany
12.6. Italy
12.7. Spain
12.8. Russia
12.9. Rest of Europe
CHAPTER NO. 13: ASIA PACIFIC ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
13.1. Asia Pacific ASIC Design IP Core Market Overview by Country Segment
13.1.1. Asia Pacific ASIC Design IP Core Market Revenue Share By Region
13.2. Asia Pacific
13.2.1. Asia Pacific ASIC Design IP Core Market Revenue By Country
13.2.2. Product Type
13.2.3. Asia Pacific ASIC Design IP Core Market Revenue By Product Type
13.2.4. Application
13.2.5. Asia Pacific ASIC Design IP Core Market Revenue By Application
13.3. China
13.4. Japan
13.5. South Korea
13.6. India
13.7. Australia
13.8. Southeast Asia
13.9. Rest of Asia Pacific
CHAPTER NO. 14: LATIN AMERICA ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
14.1. Latin America ASIC Design IP Core Market Overview by Country Segment
14.1.1. Latin America ASIC Design IP Core Market Revenue Share By Region
14.2. Latin America
14.2.1. Latin America ASIC Design IP Core Market Revenue By Country
14.2.2. Product Type
14.2.3. Latin America ASIC Design IP Core Market Revenue By Product Type
14.2.4. Application
14.2.5. Latin America ASIC Design IP Core Market Revenue By Application
14.3. Brazil
14.4. Argentina
14.5. Rest of Latin America
CHAPTER NO. 15: MIDDLE EAST ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
15.1. Middle East ASIC Design IP Core Market Overview by Country Segment
15.1.1. Middle East ASIC Design IP Core Market Revenue Share By Region
15.2. Middle East
15.2.1. Middle East ASIC Design IP Core Market Revenue By Country
15.2.2. Product Type
15.2.3. Middle East ASIC Design IP Core Market Revenue By Product Type
15.2.4. Application
15.2.5. Middle East ASIC Design IP Core Market Revenue By Application
15.3. GCC Countries
15.4. Israel
15.5. Turkey
15.6. Rest of Middle East
CHAPTER NO. 16: AFRICA ASIC DESIGN IP CORE MARKET – COUNTRY ANALYSIS
16.1. Africa ASIC Design IP Core Market Overview by Country Segment
16.1.1. Africa ASIC Design IP Core Market Revenue Share By Region
16.2. Africa
16.2.1. Africa ASIC Design IP Core Market Revenue By Country
16.2.2. Product Type
16.2.3. Africa ASIC Design IP Core Market Revenue By Product Type
16.2.4. Application
16.2.5. Africa ASIC Design IP Core Market Revenue By Application
16.3. South Africa
16.4. Egypt
16.5. Rest of Africa
CHAPTER NO. 17: COMPANY PROFILES
17.1. Arm Holdings
17.1.1. Company Overview
17.1.2. Product Type Portfolio
17.1.3. Financial Overview
17.1.4. Recent Developments
17.1.5. Growth Strategy
17.1.6. SWOT Analysis
17.2. Synopsys Inc.
17.3. Cadence Design Systems
17.4. Imagination Technologies
17.5. CEVA Inc.
17.6. Analog Devices
17.7. Maxim Integrated Products
17.8. ON Semiconductor
17.9. Qualcomm
17.10. Intel Corporation
17.11. Texas Instruments
17.12. Broadcom Inc.
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Frequently Asked Questions
What is the current size of the ASIC Design IP Core Market?
The market reached USD 6,449.01 million in 2024 and is projected to grow steadily through 2032 across key global regions.
What factors are driving the growth of the ASIC Design IP Core Market?
Demand for custom SoC designs, AI integration, 5G expansion, and energy-efficient IP cores are key drivers pushing market growth across multiple industries.
What are the key segments within the ASIC Design IP Core Market?
The market is segmented by product type, application, and region, including processor IPs, automotive use, telecom applications, and Asia Pacific growth.
What are some challenges faced by the ASIC Design IP Core Market?
Design complexity, IP integration issues, and licensing risks create hurdles, especially when dealing with heterogeneous architectures and third-party core compatibility.
Who are the major players in the ASIC Design IP Core Market?
Leading companies include Arm Holdings, Synopsys Inc., Cadence Design Systems, Intel, Broadcom, Qualcomm, Analog Devices, CEVA, and Texas Instruments.
About Author
Sushant Phapale
ICT & Automation Expert
Sushant is an expert in ICT, automation, and electronics with a passion for innovation and market trends.
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