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Ball Bonder Machine Market By Actuation (Manual, Automated) By Application (Packaging, Semiconductor & Electronics, IT & Telecommunication, Others) By Type (Manual Ball Bonder, Semi-Automatic Ball Bonder, Fully Automatic Ball Bonder), By Application (IDMs, OSAT) - Growth, Future Prospects And Competitive Analysis 2016 - 2028

The Global Ball Bonder Machine Market report explores the critical analysis of the Ball Bonder Machine industry using key parameters. The report consists of investment strategies, the need for investments in the Ball Bonder Machine industry, and the multiple benefits for the investors. Importantly, this report sets out major changes in the global technical regulations for the Ball Bonder Machine industry, as well as how economic and non-economic barriers are helping the Ball Bonder Machine market. Moreover, the report analyses the global, regional, and country-level historic and forecasted market size. The report also provides a comprehensive analysis of key investment propositions, demand and supply gap, competitors positioning, STAR analysis, SRC analysis, and Tornado analysis. Key technological developments and other analyses such as porter's five forces analysis, PESTEL analysis, value chain analysis, etc.

Key Highlights of the report

How are the major segments performing in the Ball Bonder Machine Market?

In 2021, the automated category will be the leading segment based on the actuation. The primary reason driving the segment's growth is an increase in demand for fully automatic ball bonder machines in the electronics industry due to real-time process & performance monitoring, equipment health monitoring, detection and improved post bond inspection, and simple operations.

In 2021, the semiconductor & electronics segment will lead the market. The electronics and semiconductor industries' rapid use of ball bonder machines to manufacture various semiconductor devices, including integrated circuits or chips, is a key reason for the market's expansion.

Which region dominated the Ball Bonder Machine Market?

In 2021, North America was one of the major contributors to the global ball bonder machine market because of the region's well-established and technologically advanced manufacturers and rising electronic production. These are the variables driving the region's growth in North America. Because of the region's increased electronic industry, the United States is a vital market in North America. One of the primary factors propelling this regional market is North America's dominance in terms of the manufacturing base.

What is the competitive environment of the Ball Bonder Machine Market?

The ball bonder machine market is crowded with local, regional, and international companies. As a result, the market is fragmented, and suppliers' bargaining power is limited. The level of competition among market participants is likewise considerable. Rapid technological progress has created opportunities in the global ball bonder machine market. Market participants gradually focus on merger and acquisition activities to produce new items and improve their existing product offerings. For instance, in June 2020, with the latest technologically advanced ULTRA LUX automatic wire bonder and POWER-C wedge bonder equipment on display, Kulicke & Soffa announced its participation in the Shanghai-based SEMICON China 2020 trade event. Similarly, in April 2019, an agreement between ASM Pacific Technology and the Jiujiang Municipal Government of Jiangxi Province for constructing a semiconductor materials plant in the Jiujiang Economic and Technological Development Zone was made public.

Executive Summary

How has increased demand for IDMs impacted the growth of the ball bonder machine market?

Integrated circuits (ICs) or other semiconductor devices can be connected using a ball bonder machine during chip packing. Generally constructed of copper, aluminum, gold, or silver, the connection is created using a thin wire. The ball bonding procedure creates this connection and welds the wire and chip end together using pressure, heat, and ultrasonic energy. Ball bonding devices are utilized in various applications by various end-user segments, including outsourced semiconductor assembly and testing (OSATs) and integrated device manufacturers (IDMs). The market is growing due to the rapid rise in IDM providers employing ball bonder machinery for advanced chip fabrication. The market for ball bonder machines is further driven by increased production capacity and ongoing technological advancements in packaging methods. However, increasing R&D activities and cutting-edge technologies in the semiconductor packaging industry are also anticipated to fuel the market's expansion.

Which are the key investments by the players in the Ball Bonder Machine Industry Market?

Companies manufacturing equipment must make major investments to ensure their products use cutting-edge technology. Key market players mostly focus on beginning investments to support the devices and their latest technologies. Customer and manufacturer relationship-based sales and promotion techniques enhance the semiconductor sector.

Some of the major players in the market are ASM Pacific Technology (ASMPT), DIAS Automation, F&K Delvotec Bondtechnik, Hesse GmbH, Hybond, Inc., KAIJO corporation, Kulicke & Soffa Industries, Inc., Micro Point Pro Ltd (MPP), Palomar Technologies, TPT Wire Bonder GmbH & Co KG, Ultrasonic Engineering Co. Ltd. and West Bond, Inc.

What are the Major Driving Factors for the Ball Bonder Machine Market?

The ball bonder machine market is anticipated to grow over the projected period as new electronic devices, such as smartphones, with increased functionality and new standards, become more prevalent. In the upcoming years, the market for ball bonder machines is projected to grow as end customers switch from manual to automated ball bonder machines. Growing consumer demand for electronic goods drives chip demand, which is indirectly anticipated to drive up demand for ball bonder machines throughout the projected period. In the coming years, introducing new packaging technologies, such as through-silicon (TSV) packaging and microelectromechanical systems (MEMs) packaging, will increase demand for ball bonder machines. One of the key elements anticipated to propel the global ball bonder machine market shortly is the rising use of 3D chip packing. Over the forecast period, the market expansion is anticipated to be fuelled by rising investments by various companies in the Internet of Things (IoT) technologies and rising demand for IoT devices. Over the projected period, the market for ball bonder equipment is anticipated to be driven by the expanding demand for high-bandwidth data transmission.

What are the Major Risks for the Ball Bonder Machine Market?

Ball bonder machine utilization is significantly hampered by their high cost and complexity, which is anticipated to harm the market throughout the forecast period. The likelihood of faults in semiconductor devices is increased by the manufacturing process's high level of complexity, which will constrain the market's expansion in the coming years. Additionally, the production process is constrained by a shortage of experienced ball bonder machines.

Which is the Key Application in the Ball Bonder Machine Market?

Based on application, the market is segmented into packaging, semiconductor & electronics, IT and telecommunications. In 2021, the semiconductor and electronics segment will lead the market. A significant factor in the market's growth is the quick adoption of ball bonder machines by the electronics and semiconductor industries to produce various semiconductor devices, including integrated circuits or chips. Factors like rising government and private sector investments in semiconductor-based device manufacturing and economic improvement, expanding technological developments in the electronics packaging sector, and the widespread availability of low-cost labor and raw materials are driving market expansion.

How is the Ball Bonder Machine Market performing in regions?

In 2021, the global ball bonder machine market was dominated by North America because of the region's established and technologically advanced manufacturers, as well as expanding electronic output. These are the factors fueling the region's expansion in North America. The United States is an important market in North America because of the region's growing electronic sector. The dominance of North America in manufacturing is one of the main factors fueling this geographical market. The rising market for consumer electronics and the semiconductor manufacturing industry across the region and the increased demand for electronics products such as smartphones, wearable electronics, and other smart connected devices have contributed to the market's rise.

Besides, the Asia Pacific is expected to grow significantly over the forecast period because of vendors' substantial investment in the chip production process's technological advancement. The Asia Pacific consumer electronics industry, is predicted to grow rapidly throughout the forecast period. This, in turn, will fuel the semiconductor market's growth and stimulate demand for manufacturing and packaging equipment such as ball bonder equipment. The rise in design complications, such as thinner versions, metallic cases, and larger displays in smartphones and other devices, has reduced the space for semiconductor components, boosting the APAC market for ball bonder machines.

What is the regulatory landscape for the Ball Bonder Machine Market?

Growing government and private sector investments in the U.S., technological improvements in the electronics packaging industry, and increased manufacturing of semiconductor-based products are the factors driving market growth throughout the forecast period.

What is the Market Size of Ball Bonder Machine regarding value?

The Ball Bonder Machine Market is anticipated to grow at a substantial CAGR of 3.80% in the upcoming years. The Global Ball Bonder Machine industry was estimated to be worth USD 1173.4 million in 2021 and was expected to be worth USD 1467.68 million by 2028.

What effect does COVID-19 have on the market for Ball Bonder Machine?

An increase in COVID-19 instances is causing the global economic downturn. COVID-19 is having an impact on every sector of the economy, including the worldwide semiconductor industry. In contrast, COVID-19 has no impact on equipment demand. For instance, Palomar Technologies saw demand for critical semiconductor components in April 2020. According to the company, orders for its 3880 ball bonder machines for remote equipment, medical devices, and robotics have surged. As a result, equipment demand has not dropped due to COVID-19. As a result, the global ball bonder machine market is anticipated to expand in the coming years.

Segmentation of Global Ball Bonder Machine Market-

Global Ball Bonder Machine Market – By Actuation

  • Manual
  • Automated

Global Ball Bonder Machine Market – By Application

  • Packaging
  • Semiconductor & Electronics
  • IT & Telecommunication
  • Others

Global Ball Bonder Machine Market – By Region

  • North America
    • S.
    • Canada
  • Europe
    • Germany
    • France
    • K.
    • Italy
    • Spain
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • South-east Asia
    • Rest of Asia Pacific
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • GCC Countries
    • South Africa
    • Rest of Middle East and Africa

Frequently asked questions about the global Ball Bonder Machine industry

COVID-19 is expected to negatively affect the global Ball Bonder Machine market.

North America accounted for the highest share of the global Ball Bonder Machine market.

The ball bonder machine market is anticipated to grow over the projected period as new electronic devices, such as smartphones, with increased functionality and new standards, become more prevalent.

The automated segment had a major share in 2021, with more than 60% of the market revenue.

The semiconductor & electronics segment had a major share in 2021, with more than 30% of the market revenue share.

Ball Bonder Machine Market Scope

Report Attribute Details
Market Value in 2021 USD 1173.4 million
Market Value in 2028 USD 1467.68 million
CAGR 3.80%
Benchmarking Year 2021
Past data 2016 – 2021
Forecast period 2022 – 2028
Choose License Type
Budget Buying
Executive Summary - Brief Global Market Size - Current & Forecast
Regional Market Size - North America
Country Market Size - US
Company Profile – 1
Trusted By
Godaddy
Published Date:  Sep 2022
Category:  Automation & Process Control
Report ID:   59966
Report Format:   PDF
Pages:   120
Rating:    4.4 (60)
Delivery Time: 24 Hours to 48 Hours   
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