Dual-In-Line Package Sockets Market By Product (Open Frame, Closed Frame), By Application (Consumer Electronics, Automotive, Medical, Defense) - Growth, Future Prospects And Competitive Analysis, 2019 - 2027

Increase in Integrated Circuits Market to Give Boost to the Dual-In-Line Package Sockets Market

The overall dual-in-line package sockets market is projected to register a CAGR of 5.0% through the estimation period starting from 2019 to 2027. Dual-in-line package sockets market is driven by the continued growth in the integrated circuits market. Integrated circuits have become integral to nearly all electronic devices and components. With growing dependence on electronics, the integrated circuits market is expected to continue witnessing robust growth, fueling the dual-in-line package sockets market. In addition, increased complex circuits, which required more signal and power supply, resulted in high demand for dual-in-line package sockets. Subsequently, the market is set to demonstrate strong growth over the forecast period.

Market Synopsis

Consumer Electronics Set to Dominate the Market

The consumer electronics segment leads the dual-in-line package sockets market by application type. Due to increased sales of electronic devices that incorporate integrated circuits, such as laptops, smartphones, PCs, tablets, and others, the sales of dual-in-line package sockets are rising. Also, the recent trend of miniaturization and fabrication of various technologies onto a single disk in consumer devices is driving the growth of the dual-in-line package sockets market. Further, due to rising sales of consumer electronics products, the consumer electronics segment shall continue to lead the market throughout the forecast period.

The Asia Pacific to be the Fastest Growing Region

North America led the dual-in-line package sockets market. Growing demand for consumer electronics, defense equipment, and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest-growing region. Owing to the reduction in time taken for the development of a product backed by quick changes in consumer preferences in the region, the sales for dual-in-line package sockets would increase. Further, growth in automotive and consumer electronics is driving the growth of the dual-in-line package sockets market. As a result of the aforementioned factors, Asia Pacific will be the fastest-growing segment throughout the forecast period.

Some prominent players operating in the dual-in-line package sockets market are Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech, Plastronics, Yamaichi Electronics, TE Connectivity, and Sensata Technologies, among others.

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027, considering 2018 as the base year for the research. In addition, compounded Annual Growth Rate (CAGR) for each respective segment was calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

The Dual-in-line package sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. In addition, the report provides a holistic view of the global dual-in-line package sockets market based on product type, application, and geography. 

Frequently Asked Questions:

The market for Dual-In-Line Package Sockets is expected to reach US$ XX Bn by year 2027.

The Dual-In-Line Package Sockets market is expected to see significant CAGR growth over the coming years, at 5.0%.

The report is forecasted from 2019-2027.

The base year of this report is 2021.

Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech are some of the major players in the global market.

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Published Date:  Nov 2019
Category:  Semiconductor & Electronics
Report ID:   60035
Report Format:   PDF
Pages:   170
Rating:    4.2 (58)
Delivery Time: 24 Hours to 48 Hours   
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