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Dual-In-Line Package Sockets Market By Product (Open Frame, Closed Frame), By Application (Consumer Electronics, Automotive, Medical, Defense) – Growth, Future Prospects And Competitive Analysis, 2019 – 2027

Summary
Table Of Content

Increase in Integrated Circuits Market to Give Boost to the Dual-In-Line Package Sockets Market

The overall dual-in-line package sockets market is projected to register a CAGR of 5.0% through the estimation period starting from 2019 to 2027. Dual-in-line package sockets market is driven by the continued growth in the integrated circuits market. Integrated circuits have become integral to nearly all electronic devices and components. With growing dependence on electronics, the integrated circuits market is expected to continue witnessing robust growth, fueling the dual-in-line package sockets market. In addition, increased complex circuits, which required more signal and power supply, resulted in high demand for dual-in-line package sockets. Subsequently, the market is set to demonstrate strong growth over the forecast period.

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Market Synopsis

Consumer Electronics Set to Dominate the Market

The consumer electronics segment leads the dual-in-line package sockets market by application type. Due to increased sales of electronic devices that incorporate integrated circuits, such as laptops, smartphones, PCs, tablets, and others, the sales of dual-in-line package sockets are rising. Also, the recent trend of miniaturization and fabrication of various technologies onto a single disk in consumer devices is driving the growth of the dual-in-line package sockets market. Further, due to rising sales of consumer electronics products, the consumer electronics segment shall continue to lead the market throughout the forecast period.

The Asia Pacific to be the Fastest Growing Region

North America led the dual-in-line package sockets market. Growing demand for consumer electronics, defense equipment, and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest-growing region. Owing to the reduction in time taken for the development of a product backed by quick changes in consumer preferences in the region, the sales for dual-in-line package sockets would increase. Further, growth in automotive and consumer electronics is driving the growth of the dual-in-line package sockets market. As a result of the aforementioned factors, Asia Pacific will be the fastest-growing segment throughout the forecast period.

Some prominent players operating in the dual-in-line package sockets market are Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech, Plastronics, Yamaichi Electronics, TE Connectivity, and Sensata Technologies, among others.

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027, considering 2018 as the base year for the research. In addition, compounded Annual Growth Rate (CAGR) for each respective segment was calculated for the forecast period from 2019 to 2027.

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Report Scope by Segments

The Dual-in-line package sockets market report provides market size and estimates based on market dynamics and key trends observed in the industry. In addition, the report provides a holistic view of the global dual-in-line package sockets market based on product type, application, and geography.

Chapter 1 Preface
1.1 Report Scope and Description
1.1.1 Study Purpose
1.1.2 Target Audience
1.1.3 USP and Key Offerings
1.2 Research Scope
1.3 Research Methodology
1.3.1 Phase I – Secondary Research
1.3.2 Phase II – Primary Research
1.3.3 Approach Adopted
1.3.4 Top-Down Approach
1.3.5 Bottom-Up Approach
1.3.6 Phase III – Expert Panel Review
1.3.7 Assumptions
1.4 Market Segmentation

Chapter 2 Executive Summary
2.1 Market Snapshot: Global DILPS Market
2.1.1 Global DILPS Market, by Product, 2018 (US$ Mn)
2.1.2 Global DILPS Market, by Application, 2018 (US$ Mn)
2.1.3 Global DILPS Market, by Geography, 2018 (US$ Mn)

Chapter 3 Market Dynamics
3.1 Introduction
3.2 Market Dynamics
3.2.1 Market Drivers
3.2.2 Market Restraint
3.3 Attractive Investment Proposition, by Geography, 2018
3.4 Market Positioning of Key DILPS Vendors, 2018

Chapter 4 Global Dual In Line Package Sockets (DILPS) Market, by Product
4.1 Overview
4.1.1 Global DILPS Market Value Share, by Product, 2018 & 2027 (Value, %)
4.2 Open Frame
4.2.1 Global Open Frame Market Value, 2017 – 2027 (US$ Mn)
4.3 Closed Frame
4.3.1 Global Closed Frame Market Value, 2017 – 2027 (US$ Mn)

Chapter 5 Global Dual In Line Package Sockets (DILPS) Market, by Application
5.1 Overview
5.1.1 Global DILPS Market Value Share, by Application, 2018 & 2027 (Value, %)
5.2 Consumer Electronics
5.2.1 Global DILPS Market Value from Consumer Electronics, 2017 – 2027 (US$ Mn)
5.3 Automotive
5.3.1 Global DILPS Market Value from Automotive, 2017 – 2027 (US$ Mn)
5.4 Medical
5.4.1 Global DILPS Market Value from Medical, 2017 – 2027 (US$ Mn)
5.5 Defense
5.5.1 Global DILPS Market Value from Defense, 2017 – 2027 (US$ Mn)

Chapter 6 North America Dual In Line Package Sockets (DILPS) Market Analysis, 2017 – 2027 (US$ Mn)
6.1 Overview
6.2 North America DILPS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
6.2.1 Market Analysis
6.3 North America DILPS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
6.3.1 Market Analysis
6.4 North America DILPS Market, by Country, 2017 – 2027 (US$ Mn)
6.4.1 Market Analysis
6.4.2 U.S.
6.4.3 Rest of North America

Chapter 7 Europe Dual In Line Package Sockets (DILPS) Market Analysis, 2017 – 2027 (US$ Mn)
7.1 Overview
7.2 Europe DILPS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
7.2.1 Market Analysis
7.3 Europe DILPS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
7.3.1 Market Analysis
7.4 Europe DILPS Market, by Country, 2017 – 2027 (US$ Mn)
7.4.1 Market Analysis
7.4.2 U.K.
7.4.3 Germany
7.4.4 France
7.4.5 Rest of Europe

Chapter 8 Asia Pacific Dual In Line Package Sockets (DILPS) Market Analysis, 2017 – 2027 (US$ Mn)
8.1 Overview
8.2 Asia Pacific DILPS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
8.2.1 Market Analysis
8.3 Asia Pacific DILPS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
8.3.1 Market Analysis
8.4 Asia Pacific DILPS Market, by Country, 2017 – 2027 (US$ Mn)
8.4.1 Market Analysis
8.4.2 China
8.4.3 Japan
8.4.4 India
8.4.5 Rest of Asia Pacific

Chapter 9 Rest of the World (RoW) Dual In Line Package Sockets (DILPS) Market Analysis, 2017 – 2027 (US$ Mn)
9.1 Overview
9.2 RoW DILPS Market Analysis, by Product, 2017 – 2027 (US$ Mn)
9.2.1 Market Analysis
9.3 RoW DILPS Market Analysis, by Application, 2017 – 2027 (US$ Mn)
9.3.1 Market Analysis
9.4 RoW DILPS Market, by Region (US$ Mn)
9.4.1 Market Analysis
9.4.2 Middle East & Africa (MEA)
9.4.3 Latin America

Chapter 10 Company Profiles
10.1 Enplas
10.2 Molex
10.3 Aries Electronics
10.4 3M
10.5 WinWay
10.6 Chupond Precision
10.7 Loranger
10.8 Foxconn Technology
10.9 Mill-Max
10.10 Johnstech
10.11 Plastronics
10.12 Yamaichi Electronics
10.13 TE Connectivity
10.14 Sensata Technologies

List of Figures

FIG. 1 Global Dual In Line Package Sockets (DILPS) Market: Research Methodology
FIG. 2 Market Size Estimation – Top Down & Bottom up Approach
FIG. 3 Global DILPS Market Segmentation
FIG. 4 Global DILPS Market, by Product, 2018 (US$ Mn)
FIG. 5 Global DILPS Market, by Application, 2018 (US$ Mn)
FIG. 6 Global DILPS Market, by Geography, 2018 (US$ Mn)
FIG. 7 Attractive Investment Proposition, by Geography, 2018
FIG. 8 Market Positioning of Key DILPS Vendors, 2018
FIG. 9 Global DILPS Market Value Share, by Product, 2018 & 2027 (Value, %)
FIG. 10 Global Open Frame Market Value, 2017 – 2027 (US$ Mn)
FIG. 11 Global Closed Frame Market Value, 2017 – 2027 (US$ Mn)
FIG. 12 Global DILPS Market Value Share, by Application, 2018 & 2027 (Value, %)
FIG. 13 Global DILPS Market Value from Consumer Electronics, 2017 – 2027 (US$ Mn)
FIG. 14 Global DILPS Market Value from Automotive, 2017 – 2027 (US$ Mn)
FIG. 15 Global DILPS Market Value from Medical, 2017 – 2027 (US$ Mn)
FIG. 16 Global DILPS Market Value from Defense, 2017 – 2027 (US$ Mn)

List of Tables

TABLE 1 Market Snapshot: Global Dual In Line Package Sockets (DILPS) Market Value
TABLE 2 North America DILPS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 3 North America DILPS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 4 North America DILPS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 5 Europe DILPS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 6 Europe DILPS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 7 Europe DILPS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 8 Asia Pacific DILPS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 9 Asia Pacific DILPS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 10 Asia Pacific DILPS Market Value, by Country, 2017 – 2027 (US$ Mn)
TABLE 11 RoW DILPS Market Value, by Product, 2017 – 2027 (US$ Mn)
TABLE 12 RoW DILPS Market Value, by Application, 2017 – 2027 (US$ Mn)
TABLE 13 RoW DILPS Market Value, by Region, 2017 – 2027 (US$ Mn)
TABLE 14 Enplas: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 15 Molex: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 16 Aries Electronics: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 17 3M: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 18 WinWay: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 19 Chupond Precision: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 20 Loranger: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 21 Foxconn Technology: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 22 Mill-Max: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 23 Johnstech: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 24 Plastronics: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 25 Yamaichi Electronics: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 26 TE Connectivity: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)
TABLE 27 Sensata Technologies: Company Snapshot (Business Description; Product Portfolio; Financial Information; Business Overview and Recent Development)

Frequently Asked Questions

What is the size of Dual-In-Line Package Sockets Market?

The market for Dual-In-Line Package Sockets is expected to reach US$ XX Bn by year 2027.

What is the Dual-In-Line Package Sockets Market CAGR?

The Dual-In-Line Package Sockets market is expected to see significant CAGR growth over the coming years, at 5.0%.

What is the Forecast period considered for Dual-In-Line Package Sockets Market?

The report is forecasted from 2019-2027.

What is the base year considered for Dual-In-Line Package Sockets Market?

The base year of this report is 2018.

Who are the major players in this market?

Enplas, Molex, Aries Electronics, 3M, WinWay, Chupond Precision, Loranger, Foxconn Technology, Mill-Max, Johnstech are some of the major players in the global market.

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