Semiconductor Bonder Machine Market By Type (Wire Bonder and Die Bonder), By Application (Integrated Device Manufacturer (IDMs) and Outsourced Semiconductor Assembly and Test (OSATs)) – Growth, Future Prospects and Competitive Analysis, 2019 - 2027

Rise in the design complexities like slimmer version, use of the metallic case, and the larger displays in the smartphones and the other electronics devices has reduced the space availability for the semiconductor components and in turn increased the adoption of new processing tools and is expected to drive the growth of the semiconductor bonder machine market 

The semiconductor bonder machine market worldwide is expected to grow with a CAGR of 4.02% during the forecast period from 2019 to 2027, starting from US$ 1558.54 Mn in 2018. Wire bonder equipment market is the part of the total semiconductor packaging & assembly equipment industry. Shift in the semiconductor packaging towards the 3D IC technology is expected to intensify the market competition between IDMs & OSATs. Packaging market has got huge market potential and it provides numerous growth opportunities to the IDMs & OSATs. IDMs are mainly working on the expansion into the assembly business, while the OSATs are actually trying to make the use of this chance to raise the profit margin. However, increase complexity of production process, consumption of the additional time & also increasing probability of the defects is projected to restrain the market growth rate of the semiconductor bonder machine market to some extent during forecast period. 

Market Synopsis

Semiconductor Bonder Machine Market

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Wire bonder  to Continue Dominating the Market

Wire bonder machine is projected to maintain fastest growth during the forecast period. Dominant market position in the Copper has permitted market share expansion for wire bonder machine and helped to maintain high market share in the overall semiconductor bonder machine market. The market is been driven by the cost advantages and growing semiconductor unit count. Highly customized, application-specific offering, specialized product categories in the equipment and tools development acting as a catalyst for the wire bonder growth.

Semiconductor Bonder Machine Market

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Asia Pacific to Register the Fastest Growth

Asia Pacific semiconductor bonder machine market is set to witness the high growth rate during forecast period because of the high investment made by vendors towards technological development of the chip fabrication process in this region. Moreover, the market demand of the consumer electronics in APAC region has led to the upsurge in the demand of the semiconductor packaging & equipment like wire bonder equipment. Consumer demand accounted for ~35% of the total Semiconductor market in the year 2018 . The gap between the Unit & Revenue CAGR suggests cost is expected to remain a substantial value driver for the Semiconductor market in APAC region.

Semiconductor Bonder Machine Market

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Some of the prominent players operating in the semiconductor bonder machine market include Kulicke& Soffa , DIAS Automation, ASM Pacific Technology , Palomar Technologies, F&K Delvotec Bondtechnik , Hybond , Hesse , SHINKAWA Electric ,Panasonic, Toray Engineering , FASFORD TECHNOLOGY  and West-Bond among others. 

Semiconductor Bonder Machine Market

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027 considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segments calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

The Semiconductor Bonder Machine Market report provides market size and estimates based on market dynamics and key trends observed in the industry. The report provides a holistic view of global Semiconductor Bonder Machine Market based on type, application and geography. Key segments covered in the report are as follows: 

ATTRIBUTE DETAILS
Research Period  2017-2027
Base Year 2018
Forecast Period  2019-2027
Historical Year  2017
Unit  USD Million
Segmentation

 Type Segment (2017–2027; US$ Mn)
 • Wire Bonder
 • Die Bonder 

 Application Segment (2017–2027; US$ Mn)
 • Integrated Device Manufacturer (IDMs)
 • Outsourced Semiconductor Assembly and Test (OSATs) 

 Geography Segment (2017–2027; US$ Mn)
 • North America (U.S. and Rest of North America)
 • Europe (U.K., Germany, France, and Rest of Europe)
 • Asia Pacific (Japan, China, India, and Rest of Asia Pacific)
 • Rest of World (Middle East & Africa (MEA), Latin America)

Key questions answered in this report

  • What was the market size of Semiconductor Bonder Machine in 2018 and forecast up to 2027?
  • Which is the largest regional market for Semiconductor Bonder Machine?
  • What are the major trends followed in overall Semiconductor Bonder Machine across different regions?
  • Who are the key Semiconductor Bonder Machine companies leading the market?
  • What are the key strategies adopted by the leading Semiconductor Bonder Machine companies in market? 

Unique data points of this report

  • Statistics on Semiconductor Bonder Machine penetration and spending worldwide
  • Recent trends across different regions in terms of adoption of Semiconductor Bonder Machine  across various applications
  • Notable developments going on in Semiconductor Bonder Machine
  • Attractive investment proposition for segments as well as geography
  • Comparative scenario for all the segments for years 2018 (actual) and 2027 (forecast)
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Published Date:  Sep 2019
Category:  Semiconductor & Electronics
Report ID:   59944
Report Format:   PDF
Pages:   120
Rating:    4.2 (49)
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