Semiconductor Bonder Machine Market By Type (Wire Bonder and Die Bonder), By Application (Integrated Device Manufacturer (IDMs) and Outsourced Semiconductor Assembly and Test (OSATs)) – Growth, Future Prospects and Competitive Analysis, 2019 - 2027

The rise in the design complexities like slimmer versions, use of the metallic case, and larger displays in smartphones and other electronic devices have reduced the space available for the semiconductor components and, in turn, increased the adoption of new processing tools. It is expected to drive the growth of the semiconductor bonder machine market. 

The semiconductor bonder machine market worldwide is expected to grow with a CAGR of 4.02% during the forecast period from 2019 to 2027, starting from US$ 1558.54 Mn in 2018. The wire bonder equipment market is part of the total semiconductor packaging & assembly equipment industry. The shift in semiconductor packaging towards 3D IC technology is expected to intensify the market competition between IDMs & OSATs. The packaging market has huge potential and provides numerous growth opportunities to the IDMs & OSATs. IDMs are mainly working on expanding into the assembly business, while the OSATs are trying to use this chance to raise the profit margin. However, the increasing complexity of the production process, consumption of additional time & also increasing probability of defects is projected to somewhat restrain the market growth rate of the semiconductor bonder machine market during the forecast period. 

Market Synopsis

Wire bonder to Continue Dominating the Market

Wire bonder machine is projected to maintain the fastest growth during the forecast period. Dominant market position in Copper has permitted market share expansion for wire bonder machines and helped to maintain a high market share in the overall semiconductor bonder machine market. The market is been driven by the cost advantages and growing semiconductor unit count. In addition, highly customized, application-specific offerings and specialized product categories in the equipment and tools development act as a catalyst for the wire bonder growth.

The Asia Pacific to Register the Fastest Growth

Asia Pacific semiconductor bonder machine market is set to witness a high growth rate during the forecast period because of the high investment made by vendors towards the technological development of the chip fabrication process in this region. Moreover, the market demand for consumer electronics in the APAC region has increased demand for semiconductor packaging & equipment like wire bonder equipment. Consumer demand accounted for ~35% of the total Semiconductor market in the year 2018. The gap between the Unit & Revenue CAGR suggests the cost is expected to remain a substantial value driver for the Semiconductor market in the APAC region.

Some prominent players operating in the semiconductor bonder machine market include Kulicke&Soffa, DIAS Automation, ASM Pacific Technology, Palomar Technologies, F&K DelvotecBondtechnik, Hybond, Hesse, SHINKAWA Electric, Panasonic, Toray Engineering, FASFORD TECHNOLOGY, and West-Bond among others. 

Historical & Forecast Period

This research report presents the analysis of each segment from 2017 to 2027, considering 2018 as the base year for the research. Compounded Annual Growth Rate (CAGR) for each respective segment calculated for the forecast period from 2019 to 2027.

Report Scope by Segments

The Semiconductor Bonder Machine Market report provides market size and estimates based on market dynamics and key trends observed in the industry. In addition, the report provides a holistic view of the global Semiconductor Bonder Machine Market based on type, application, and geography. Key segments covered in the report are as follows: 

Segmentation Type Segment (2017–2027; US$ Mn)

• Wire Bonder
• Die Bonder 

Application Segment (2017–2027; US$ Mn)

• Integrated Device Manufacturers (IDMs)
• Outsourced Semiconductor Assembly and Test (OSATs) 

Geography Segment (2017–2027; US$ Mn)

• North America (U.S. and Rest of North America)
• Europe (U.K., Germany, France, and Rest of Europe)
• Asia Pacific (Japan, China, India, and Rest of Asia Pacific)
• Rest of World (Middle East & Africa (MEA), Latin America)

Unique data points of this report

• Statistics on Semiconductor Bonder Machine penetration and spending worldwide
• Recent trends across different regions in terms of the adoption of Semiconductor Bonder Machines across various applications
• Notable developments going on in Semiconductor Bonder Machine.
• Attractive investment proposition for segments as well as geography
• Comparative scenario for all the segments for years 2018 (actual) and 2027 (forecast)

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